Heterogeneous Integration of Power Conversion using Power Supply on Chip and Power Supply in Package

The talk will discuss the performance opportunities and technology challenges through the emergence of heterogeneous integration of power converters (including power management ICs, power switches, magnetics and capacitors) into processor packages using PCBembedding, 2.5D or even 3D packaging concepts to deliver significant system-level energy savings. This talk will discuss the impact of the commercial emergence, of magnetics-on-silicon technology and associated PCB-embedded magnetics technologies which are enabling Power Supply on Chip and Power Supply in Package platforms. These technologies, along with integrated high density capacitor technologies, PMICs and power switches, are central to the ongoing development of the concept of integrated, granular power for multi-core microprocessors and other complex system-on-chip (SOC) platforms.

Automated summary

This talk will discuss the performance opportunities and technology challenges of heterogeneous integration of power converters into processor packages through methods like PCB embedding, 2.5D or even 3D packaging. The emergence of magnetics-on-silicon technology and PCB-embedded magnetics technologies, along with integrated high density capacitor technologies, PMICs and power switches, are central to the development of integrated power solutions for multi-core microprocessors and other complex SOC platforms.