3.8 Proceedings Paper

Interpretation and modelling of dynamic-RON kinetics in GaN-on-Si HEMTs for mm-wave applications

相关参考文献

注意:仅列出部分参考文献,下载原文获取全部文献信息。
Article Engineering, Electrical & Electronic

Improved Power Performance and the Mechanism of AlGaN/GaN HEMTs Using Si-Rich SiN/S3N4 Bilayer Passivation

Jielong Liu et al.

Summary: This study investigated AlGaN/GaN HEMTs with Si-rich SiN/Si3N4 bilayer passivation, finding that the use of a Si-rich SiN interlayer can enhance channel transport property, current collapse, power performance, and temperature stability. Devices without this interlayer exhibit increased gate leakage current and current collapse with temperature, while those with Si-rich SiN passivation show weak temperature dependence and consistent current collapse. The improved power performance of devices with Si-rich SiN interlayer passivation is attributed to suppressed current collapse and superior device stability at high channel temperatures.

IEEE TRANSACTIONS ON ELECTRON DEVICES (2022)

Article Engineering, Electrical & Electronic

Cumulative Hot-Electron Trapping in GaN-Based Power HEMTs Observed by an Ultrafast (10 V/Ns) On-Wafer Methodology

Nicola Modolo et al.

Summary: The goal of this study is to investigate the impact of hard switching on the dynamic performance of GaN HEMTs. By developing a fast testing system, the researchers found that optimizing the drain node capacitance can accelerate the hard-switching transition. Through experiments at multiple frequencies, it was demonstrated that cumulative turn-on stress has a stronger effect on R-ON compared to off-state stress. By comparing devices with different LCDs, hot electrons were identified as the main mechanism in device degradation. Furthermore, comparing wafers with different processing conditions revealed the significant impact of buffer properties on the dynamic performance of devices in hard switching.

IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS (2022)

Article Engineering, Electrical & Electronic

Partial Recovery of Dynamic RON Versus OFF-State Stress Voltage in p-GaN Gate AlGaN/GaN Power HEMTs

Marcello Cioni et al.

Summary: Dynamic R-ON dispersion in GaN power HEMTs is a known issue caused by buffer traps, affecting performance and stability. Research shows that R-ON reaches a maximum for some OFF-state voltage values and then partially recovers. This behavior is attributed to the charging/discharging dynamics of C-related buffer traps, with R-ON increasing up to 60% and partially recovering to about 30% for certain voltage values.

IEEE TRANSACTIONS ON ELECTRON DEVICES (2021)

Article Engineering, Electrical & Electronic

Surface State Spectrum of AlGaN/AlN/GaN Extracted From Static Equilibrium Electrostatics

Hao Yu et al.

Summary: The density of AlGaN surface states was extracted and analyzed, showing the influence of AlN thickness on 2DEG density and AlGaN surface potential. The accuracy and factors affecting the DSS extraction method were demonstrated.

IEEE TRANSACTIONS ON ELECTRON DEVICES (2021)

Article Engineering, Electrical & Electronic

Hole Redistribution Model Explaining the Thermally Activated RON Stress/Recovery Transients in Carbon-Doped AlGaN/GaN Power MIS-HEMTs

Nicolo Zagni et al.

Summary: By conducting 2-D device simulations on carbon-doped AlGaN/GaN power MIS-HEMTs, it is discovered that the changes in R-ON during stress and recovery experiments can be explained by a model based on hole redistribution. The limited hole emission by carbon-related acceptors at an energy level of about 0.9 eV is found to be the key factor affecting both degradation and recovery processes.

IEEE TRANSACTIONS ON ELECTRON DEVICES (2021)

Article Engineering, Electrical & Electronic

Research on GaN-Based RF Devices: High-Frequency Gate Structure Design, Submicrometer-Length Gate Fabrication, Suppressed SCE, Low Parasitic Resistance, Minimized Current Collapse, and Lower Gate Leakage

Yue Hao et al.

Summary: The technology of RF devices and circuits, as an important part of wireless communication systems, has been progressing rapidly. Vacuum electronic devices, such as traveling wave tubes, are widely used for high-frequency and high-power applications, despite their large size and integration challenges.

IEEE MICROWAVE MAGAZINE (2021)

Article Engineering, Electrical & Electronic

Influence of Carbon on pBTI Degradation in GaN-on-Si E-Mode MOSc-HEMT

A. G. Viey et al.

Summary: This study investigated threshold-voltage V-TH instabilities in GaN-on-Si devices under positive gate voltage stress, revealing the influence of trap populations related to Al2O3 gate oxide defects and C-N acceptors in the GaN lattice. Two different underlying mechanisms causing V-TH instabilities were simulated by TCAD, providing a better understanding of the BTI degradation in GaN-HEMT technologies.

IEEE TRANSACTIONS ON ELECTRON DEVICES (2021)

Article Engineering, Electrical & Electronic

Physical Modeling of Charge Trapping Effects in GaN/Si Devices and Incorporation in the ASM-HEMT Model

Mamta Pradhan et al.

Summary: This work models the dynamic behavior of gallium nitride on silicon high electron mobility transistors (GaN/Si HEMT) with carbon doped buffer using a finite state machine embedded into the core Advanced SPICE Model for High Electron Mobility Transistor (ASM-HEMT). The model, based on trapping and detrapping of electrons in carbon at nitrogen-site acceptor trap (C-N), does not require an equivalent Resistance-Capacitance circuit and is validated against different off-state stress drain voltages using only C-N as trap species.

IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY (2021)

Proceedings Paper Engineering, Multidisciplinary

On the impact of buffer and GaN-channel thickness on current dispersion for GaN-on-Si RF/mmWave devices

V Putcha et al.

Summary: The GaN-on-Si technology for future RF/6G/mm-Wave applications requires a strong buffer design for improved device performance and reliability. Defect states in the buffer layers can have a detrimental impact on device performance, with dynamic-R-ON being a key reliability concern. An improved current transient spectroscopy technique is used to analyze buffer defects and their impact on dynamic-R-ON.

2021 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS) (2021)

Article Engineering, Electrical & Electronic

Dynamic ON-Resistance in GaN-on-Si HEMTs: Origins, Dependencies, and Future Characterization Frameworks

Grayson Zulauf et al.

IEEE TRANSACTIONS ON POWER ELECTRONICS (2020)

Article Engineering, Electrical & Electronic

Analysis of DC, Channel Temperature, and RF Performance of In Situ SiN/AlGaN-Sandwich-Barrier/GaN/Al0.05GaN HEMTs

Ling Yang et al.

IEEE TRANSACTIONS ON ELECTRON DEVICES (2020)

Article Engineering, Electrical & Electronic

Extensive assessment of the charge-trapping kinetics in InGaAs MOS gate-stacks for the demonstration of improved BTI reliability

Vamsi Putcha et al.

MICROELECTRONICS RELIABILITY (2020)

Article Engineering, Electrical & Electronic

The Impact of Multi-MHz Switching Frequencies on Dynamic On-Resistance in GaN-on-Si HEMTs

Grayson Zulauf et al.

IEEE OPEN JOURNAL OF POWER ELECTRONICS (2020)

Article Engineering, Electrical & Electronic

Microwave Characterization of Trapping Effects in 100-nm GaN-on-Si HEMT Technology

Gian Piero Gibiino et al.

IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS (2019)

Article Engineering, Electrical & Electronic

Linearity and robustness evaluation of 150-nm AlN/GaN HEMTs

M. Rzin et al.

MICROELECTRONICS RELIABILITY (2019)

Article Engineering, Electrical & Electronic

Dynamic On-Resistance in GaN Power Devices: Mechanisms, Characterizations, and Modeling

Shu Yang et al.

IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS (2019)

Article Multidisciplinary Sciences

The detrimental effect of AlGaN barrier quality on carrier dynamics in AlGaN/GaN interface

Zydrunas Podlipskas et al.

SCIENTIFIC REPORTS (2019)

Article Engineering, Electrical & Electronic

High Performance and Highly Robust AlN/GaN HEMTs for Millimeter-Wave Operation

Kathia Harrouche et al.

IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY (2019)

Article Engineering, Electrical & Electronic

Investigation on the Activation Energy of Device Degradation and Switching Time in AlGaN/GaN HEMTs for High-Frequency Application

Jianming Lei et al.

IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY (2019)

Proceedings Paper Engineering, Electrical & Electronic

High Power Density ScAlN-Based Heterostructure FETs for mm-Wave Applications

Thomas E. Kazior et al.

2019 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS) (2019)

Article Nanoscience & Nanotechnology

C-DLTS interface defects in Al0.22Ga0.78N/GaN HEMTs on SiC: Spatial location of E2 traps

I Jabbari et al.

PHYSICA E-LOW-DIMENSIONAL SYSTEMS & NANOSTRUCTURES (2018)

Article Chemistry, Analytical

Investigation on the I-V Kink Effect in Large Signal Modeling of AlGaN/GaN HEMTs

Shuman Mao et al.

MICROMACHINES (2018)

Article Engineering, Electrical & Electronic

Leaky Dielectric Model for the Suppression of Dynamic RON in Carbon-Doped AlGaN/GaN HEMTs

Michael J. Uren et al.

IEEE TRANSACTIONS ON ELECTRON DEVICES (2017)

Article Engineering, Electrical & Electronic

A Prepulsing Technique for the Characterization of GaN Power Amplifiers With Dynamic Supply Under Controlled Thermal and Trapping States

Corrado Florian et al.

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES (2017)

Review Engineering, Electrical & Electronic

Reliability and parasitic issues in GaN-based power HEMTs: a review

G. Meneghesso et al.

SEMICONDUCTOR SCIENCE AND TECHNOLOGY (2016)

Article Materials Science, Multidisciplinary

Deep Traps in AlGaN/GaN High Electron Mobility Transistors on SiC

A. Y. Polyakov et al.

ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY (2016)

Article Engineering, Electrical & Electronic

Kinetics of Buffer-Related RON-Increase in GaN-on-Silicon MIS-HEMTs

Davide Bisi et al.

IEEE ELECTRON DEVICE LETTERS (2014)

Article Engineering, Electrical & Electronic

Deep-Level Characterization in GaN HEMTs-Part I: Advantages and Limitations of Drain Current Transient Measurements

Davide Bisi et al.

IEEE TRANSACTIONS ON ELECTRON DEVICES (2013)

Article Engineering, Electrical & Electronic

Inverse temperature dependence of reverse gate leakage current in AlGaN/GaN HEMT

J. K. Kaushik et al.

SEMICONDUCTOR SCIENCE AND TECHNOLOGY (2013)

Article Engineering, Electrical & Electronic

Stochastic charge trapping in oxides: From random telegraph noise to bias temperature instabilities

Tibor Grasser

MICROELECTRONICS RELIABILITY (2012)

Article Engineering, Electrical & Electronic

A Current-Transient Methodology for Trap Analysis for GaN High Electron Mobility Transistors

Jungwoo Joh et al.

IEEE TRANSACTIONS ON ELECTRON DEVICES (2011)

Article Engineering, Electrical & Electronic

High breakdown voltage AlGaN-GaN Power-HEMT design and high current density switching behavior

W Saito et al.

IEEE TRANSACTIONS ON ELECTRON DEVICES (2003)

Article Engineering, Electrical & Electronic

AlGaN/GaN HEMTs - An overview of device operation and applications

UK Mishra et al.

PROCEEDINGS OF THE IEEE (2002)