Recent Advancements in Liquid Metal Flexible Printed Electronics: Properties, Technologies, and Applications

This article presents an overview on typical properties, technologies, and applications of liquid metal based flexible printed electronics. The core manufacturing materialroom-temperature liquid metal, currently mainly represented by gallium and its alloys with the properties of excellent resistivity, enormous bendability, low adhesion, and large surface tension, was focused on in particular. In addition, a series of recently developed printing technologies spanning from personal electronic circuit printing (direct painting or writing, mechanical system printing, mask layer based printing, high-resolution nanoimprinting, etc.) to 3D room temperature liquid metal printing is comprehensively reviewed. Applications of these planar or three-dimensional printing technologies and the related liquid metal alloy inks in making flexible electronics, such as electronical components, health care sensors, and other functional devices were discussed. The significantly different adhesions of liquid metal inks on various substrates under different oxidation degrees, weakness of circuits, difficulty of fabricating high-accuracy devices, and low rate of good productall of which are challenges faced by current liquid metal flexible printed electronicsare discussed. Prospects for liquid metal flexible printed electronics to develop ending user electronics and more extensive applications in the future are given.