Demonstration of Silicon-Photonics Hybrid Glass-Epoxy Substrate for Co-Packaged Optics

To realize a new package substrate for co-packaged optics, silicon-photonics hybrid glasse-poxy substrate with optical redistribution layer was demonstrated. 112 Gbps PAM-4 transmissions through the hybrid substrate were demonstrated with the TDECQ less than 3.4 dB. (c) 2022 The Author(s)

Automated summary

In this study, a new package substrate for co-packaged optics was realized using a silicon-photonics hybrid glass-epoxy substrate with an optical redistribution layer. The transmission of 112 Gbps PAM-4 through the hybrid substrate was demonstrated with a TDECQ of less than 3.4 dB.