4.3 Article

Development of empirical correlations for assessing the CuAlMn based shape memory alloy thermal switch phase transition temperatures

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SPRINGER INDIA
DOI: 10.1007/s12046-023-02248-3

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Heat switch; shape memory alloy; low temperature; empirical correlation

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This paper presents empirical correlations to predict the phase transition temperatures of CuAlMn shape memory alloy and analyzes the effects of Cu/Al ratio on these temperatures. It is found that the proportion of "Mn" in CuAlMn alloy plays a crucial role in achieving low-temperature actuation, enhanced switching ratio, and overall performance improvement. These findings are important for the design of mechanical heat switches for low-temperature space applications.
This paper presents the empirical correlations to predict the phase transition temperatures of CuAlMn based shape memory alloy thermal/heat switches. The correlations can precisely predict the start and finish phase transition temperatures of austenite and martensite lattice structures within the error range of +/- 18% at different Cu/Al and Cu/Mn compositions in CuAlMn shape memory alloy. Moreover, for the first time, contours on the effect of Cu/Al ratio on phase transition temperatures are analyzed in detail. It has been found that 'Mn' compassions in CuAlMn alloy play a critical role, and should be at the higher end of composition to achieve low-temperature actuation (<123 K), enhanced switching ratio, and overall performance improvement in shape memory alloy-based heat switches. The precise performance prediction of CuAlMn based shape memory alloy will be helpful in the design of effective mechanical heat switches for low-temperature space applications.

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