Ultrasonic-induced metallurgical bonding between W90 tungsten heavy alloy and AZ31B Mg alloy using Sn

W90 tungsten heavy alloy (W90) and AZ31B Mg alloy were firstly bonded by ultrasonic-assisted soldering using Sn in atmospheric environment. The wetting angle of Sn on W90 decreased to 130.7 degrees under the action of ultrasound. The microstructure of W90/Sn/Mg joint treated with 2 s of ultrasounication time was W90/Mg2Sn + Sn/Mg2Sn layer/Mg. As the ultrasonication time increased to 4 s, the joint width reduced and the thickness of Mg2Sn layer increased. The joint strength decreased from 10.4 MPa to 5.1 MPa as the ultrasonication time increased from 2 s to 4 s. A semi-coherent interface formed at the Sn/W interface as the ultrasound was applied.

Automated summary

This study investigates the bonding of W90 tungsten heavy alloy and AZ31B magnesium alloy using ultrasonic-assisted soldering in atmospheric environment. The wetting behavior of Sn on W90 is improved with the application of ultrasound, but prolonged ultrasonication reduces the joint strength. A semi-coherent interface is formed at the Sn/W interface upon ultrasound.