相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。TSV Integration With Chip Level TSV-to-Pad Cu/SiO2 Hybrid Bonding for DRAM Multiple Layer Stacking
Tzu-Heng Hung et al.
IEEE ELECTRON DEVICE LETTERS (2023)
Investigation of bonding mechanism for low-temperature Cu-Cu bonding with passivation layer
Zhong-Jie Hong et al.
APPLIED SURFACE SCIENCE (2022)
Advanced Substrate Packaging Technologies for Enabling Heterogeneous Integration (HI) Applications
G. Duan et al.
2022 INTERNATIONAL ELECTRON DEVICES MEETING, IEDM (2022)
High Performance and Energy Efficient Computing with Advanced SoIC™ Scaling
S. W. Liang et al.
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022) (2022)
Search for copper diffusion at hybrid bonding interface through chemical and electrical characterizations
Joris Jourdon et al.
MICROELECTRONICS RELIABILITY (2021)
Low-Temperature (260 °C) Solderless Cu-Cu Bonding for Fine-Pitch 3-D Packaging and Heterogeneous Integration
Haesung Park et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2021)
Sputtered Coppe Nitride-Coppe Nitride Direct Bonding
Liangxing Hu et al.
2021 7TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) (2021)
Plasma Activated Low-temperature Die-level Direct Bonding with Advanced Wafer Dicing Technologies for 3D Heterogeneous Integration
Katsuyuki Sakuma et al.
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021) (2021)
Low temperature Direct Bonding of SiN and SiO interfaces for packaging applications
Xavier F. Brun et al.
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020) (2020)
Comprehensive Analysis of a Cu Nitride Passivated Surface That Enhances Cu-to-Cu Bonding
Hankyeol Seo et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2020)
System on Integrated Chips (SoICTM) for 3D Heterogeneous Integration
F. C. Chen et al.
2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) (2019)
Preparation, structure, properties, and application of copper nitride (Cu3N) thin films: A review
Aihua Jiang et al.
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY (2018)
Characterization of self-assembled monolayers for Cu-Cu bonding technology
M. Lykova et al.
MICROELECTRONIC ENGINEERING (2018)
Embedded Multi-Die Interconnect Bridge (EMIB) - A High Density, High Bandwidth Packaging Interconnect
Ravi Mahajan et al.
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) (2016)
Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu
Chien-Min Liu et al.
SCIENTIFIC REPORTS (2015)
Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement
C. S. Tan et al.
MICROELECTRONICS RELIABILITY (2012)
Thermal stability of copper nitride thin films: The role of nitrogen migration
R. Gonzalez-Arrabal et al.
JOURNAL OF APPLIED PHYSICS (2010)
Si-H bond breaking induced retention degradation during packaging process of 256 Mbit.DRAMs with negative wordline bias
MC Chang et al.
IEEE TRANSACTIONS ON ELECTRON DEVICES (2005)