☆ 4.5 Article

A Feasible Method for Fabricating Vertical Taper Applied to Spot Size Converter

IEEE PHOTONICS TECHNOLOGY LETTERS (2023)

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Fabrication of vertical-taper structures for silicon photonic devices by using local-thickness-thinning process

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Summary: This paper presents a simple fabrication process for silicon photonic devices using vertical-taper structures that can locally adjust the thickness. A step-and-exposure lithography process is developed to create gradual-slope vertical tapers by repeated light exposure and wafer stage movement. This process is conducted at a lower temperature and is compatible with the complementary metal-oxide-semiconductor process. A lithography model is used to predict the taper angle, and experimental results validate the theoretical angles. The demonstrated conversion of a 400 nm thick silicon waveguide to 220 nm thickness achieved low insertion loss.

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