Properties of lightweight particleboard made with sunflower stalk particles in the core layer

In this study we assessed the efficacy of manufacturing lightweight particleboards using sunflower (Helianthus annuus L.) stalk particles. Three-layer lightweight particleboards with target densities of 350, 450 and 550 kg/m3 were produced with different proportions of wood-to-sunflower stalk particles (100:0%, 75:25%, 50:50%, 25:75%, 0:100%) in the core layer. The outer layers consisted only of wood particles. The boards made entirely with wood particles in the outer and core layers were reference boards. Conventional urea-formaldehyde (UF) resin was used to bond the particles. It was found that the replacement of wood particles in the core layer with sunflower stalk particles led to an improvement in the physical and mechanical properties of lightweight UF-bonded particleboards. Three-layer boards with the optimum combination of 100% wood particles in the outer layers and 100% sunflower stalk particles in the core layer had slightly higher bending strength (MOR) and modulus of elasticity (MOE) than boards made entirely from 100% wood particles, but much greater internal bonding strength (IB), lower water absorption (WA) and less thickness swelling (TS) at the same board density. The MOR, MOE and IB values for 550 kg/m3 boards containing 100% sunflower particles in the core layer were higher than the reference boards by 16.3%, 16.6% and 62.7%, respectively. The MOR, MOE and IB of lightweight particleboards with densities of 450 and 550 kg/m3 made with 100% sunflower particles in the core layer fully complied with the CEN/TS 16368 standard for both types of board, LP1 and LP2. Substitution of wood particles with sunflower stalk particles did not cause negative changes in the formaldehyde content of the boards.

Automated summary

This study assessed the efficacy of manufacturing lightweight particleboards using sunflower stalk particles. The results showed that replacing wood particles with sunflower stalk particles improved the physical and mechanical properties of the particleboards.