☆ 4.7 Review

Laser drilling in silicon carbide and silicon carbide matrix composites

OPTICS AND LASER TECHNOLOGY (2024)

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Article Electrochemistry

Dopant Selective Photoelectrochemical Etching of SiC

Samuel Whiteley et al.

Summary: Single crystalline 4H-SiC is a promising wide-gap semiconductor for MEMS and quantum devices. However, challenges remain in the micro and nano-fabrication of SiC to create precise photonic structures with nanometer-scale precision. This study investigates UV photoelectrochemical processing of SiC and demonstrates high dopant-type selectivity, reduced layer thickness variation, fast etch rate, and smooth etched surface. These findings provide a scalable approach for the fabrication of nanoscale SiC structures and electronic devices, enabling the development of next-generation MEMS and photonic quantum devices.

JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2023)

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Article Chemistry, Multidisciplinary

Laser-Induced Cavitation-Assisted True 3D Nano-Sculpturing of Hard Materials

Jian-Guan Hua et al.

Summary: Femtosecond lasers enable flexible and thermal-damage-free ablation of solid materials, but true 3D nano-sculpturing has not been achieved due to technical challenges. This article proposes a new technique using cavitation dynamics and backside ablation to achieve stable material removal for precise 3D fabrication. With this technique, 3D devices with surface roughness less than 10 nm can be produced, enabling novel structural and functional micro-nano optics and non-silicon micro-electro-mechanical systems.

SMALL (2023)

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Article Materials Science, Ceramics

Two-step femtosecond laser etching for bulk micromachining of 4H-SiC membrane applied in pressure sensing

Lukang Wang et al.

Summary: This paper presents a two-step laser etching method for bulk micromachining of 4H-SiC membranes. The first step involves rapid material removal, while the second step aims to improve surface morphology. By controlling variables such as laser fluence and scanning parameters, the researchers achieved a better surface morphology with the two-step laser etching method. The processing time was significantly reduced compared to one-step etching, and the membrane's roughness had a direct impact on the sensitivity of the SiC pressure sensor.

CERAMICS INTERNATIONAL (2022)

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Article Engineering, Electrical & Electronic

Development of Laser-Micromachined 4H-SiC MEMS Piezoresistive Pressure Sensors for Corrosive Environments

Lukang Wang et al.

Summary: In this study, femtosecond laser technology was used to fabricate 128 SiC-based piezoresistive pressure sensor diaphragms. The sensors demonstrated accurate pressure measurement performance and good tolerance to temperature, indicating potential for various applications.

IEEE TRANSACTIONS ON ELECTRON DEVICES (2022)

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Article Materials Science, Multidisciplinary

Fabrication of 4H-SiC microvias using a femtosecond laser assisted by a protective layer

Bin Liu et al.

Summary: SiC microvias with high quality were fabricated using the protective-layer-assisted femtosecond laser drilling method. The results show the selection of suitable protective layer material and thickness can improve the entrance morphology, but the exit morphology remains poor and requires cleaning and corrosion treatment. By combining a protective layer and water, microvias with smooth inner walls and consistent hole arrays were obtained.

OPTICAL MATERIALS (2022)

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Article Optics

Research on hole depth in femtosecond laser deep micropore processing technology based on filament effect

Bin Liu et al.

Summary: This paper mainly studied the effect of femtosecond laser on the processing of micropores in SiC/SiC composites. The experimental results showed that different processing methods have different effects on the depth of micropores, providing theoretical and technical support for practical applications in the aerospace field.

OPTIK (2022)

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Article Chemistry, Multidisciplinary

Free-Form Micro-Optics Out of Crystals: Femtosecond Laser 3D Sculpturing

Jian-Guan Hua et al.

Summary: This work presents a universal and flexible technology for the fabrication of crystalline micro-optics with required shape and surface roughness. By combining femtosecond laser ablation with high-temperature treatment, the rough non-crystalline layer caused by ablation is removed and the surface roughness is reduced to approximately 2 nm without changing the structure shape. This technology offers nanoscale resolution and free-form 3D manufacturing capability for various crystals, providing a new approach to fabricate micro-/integrated-optics and nonlinear optical elements.

ADVANCED FUNCTIONAL MATERIALS (2022)

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Article Materials Science, Ceramics

Investigation of structural transformation and residual stress under single femtosecond laser pulse irradiation of 4H-SiC

Haiyan Shi et al.

Summary: This study presents a comprehensive investigation of the structural transformation and residual stress induced by femtosecond laser irradiation on a 4H-SiC target. The obtained results show energy-dependent structural characteristics and spatial distribution. It provides insights into the laser-material interaction mechanisms and offers suggestions for improving surface quality.

CERAMICS INTERNATIONAL (2022)

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Article Automation & Control Systems

Influence of laser parameters on processing microgrooves of 2.5-dimensional C/SiC composites via nanosecond laser

Haowen Jiao et al.

Summary: By using nanosecond laser to process C/SiC composites, the study showed significant differences in material removal and morphology between the start and end of the groove, and the morphology of the ablated groove was influenced by the fiber arrangement direction. Simulation results of the temperature field demonstrated temperature differences and distribution variations.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2022)

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Article Engineering, Electrical & Electronic

Numerical and experimental analysis of nanosecond laser ablation of SiC

Ya Deng et al.

Summary: This work presents a fundamental study on the melting threshold, ablation morphology and removal mechanism of single-crystal SiC during nanosecond laser processing. A thermal model was established to investigate the thermal behavior of single-crystal SiC at different wavelengths and pulse durations, and to predict the size and cross-sectional profile of ablation hole. The investigation results indicated that the melting threshold of crystalline material increased with the increase of wavelength under the studied condition and surface evaporation should be the dominant removal mechanism for nanosecond laser pulse ablation of SiC.

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2022)

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Article Multidisciplinary Sciences

3D nanoprinting of semiconductor quantum dots by photoexcitation-induced chemical bonding

Shao-Feng Liu et al.

Summary: Researchers have developed a polymerization-independent laser direct writing technique for printing arbitrary 3D quantum dot structures with nanoscale resolution. This technique improves material purity and intrinsic properties, and holds potential for the manufacturing of optoelectronic devices.

SCIENCE (2022)

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Article Optics

Biomimetic sapphire windows enabled by inside-out femtosecond laser deep-scribing

Xue-Qing Liu et al.

Summary: In this study, an inside-out femtosecond laser deep scribing technology combined with etching process was used to fabricate biomimetic micro/nanostructures with high aspect ratio on ultrahard materials. The use of a sacrificial layer of silicon oxide for surface protection effectively avoided surface damage and allowed the fabrication of high-quality microstructures. As a proof-of-concept application, a moth-eye inspired antireflective window with sub-wavelength pyramid arrays was produced on sapphire surface, achieving broadband and high transmittance.

PHOTONIX (2022)

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Article Automation & Control Systems

Water-assisted femtosecond laser drilling of 4H-SiC to eliminate cracks and surface material shedding

Wenjun Wang et al.

Summary: This study used femtosecond laser to drill high-aspect-ratio micro through holes on a 4H-SiC wafer, finding that water-assisted femtosecond laser drilling can effectively eliminate cracks and surface material shedding. The water layer thickness and laser repetition frequency have a significant impact on processing quality and efficiency.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2021)

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Article Automation & Control Systems

Removal mechanism of 2.5-dimensional carbon fiber reinforced ceramic matrix composites processed by nanosecond laser

Haowen Jiao et al.

Summary: This paper investigates the laser ablation mechanism and morphology changes of 2.5-dimensional C/SiC composite material using nanosecond laser. The results show that different fiber orientations and ablation areas have varying effects on the ablation morphology.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2021)

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Article Materials Science, Ceramics

Femtosecond laser micromachining in combination with ICP etching for 4H-SiC pressure sensor membranes

Lukang Wang et al.

Summary: Utilizing a Yb:KGW femtosecond laser to fabricate 4H-SiC sensor membranes has shown potential in achieving high size accuracy and steep sidewalls, with wet cleaning and ICP etching playing a significant role in improving membrane surface morphology. Energy-Dispersive X-ray Spectroscopy and Raman spectrum analysis confirmed that the crystal properties of the membrane bottom and thin epitaxial layers on the front side were not damaged by the micromachining process.

CERAMICS INTERNATIONAL (2021)

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Article Engineering, Multidisciplinary

Investigation of damage generation process by stress waves during femtosecond laser drilling of SiC

Junya Hattori et al.

Summary: This study reveals the mechanism of damage generation during femtosecond laser processing of SiC through high-speed imaging and simulation of experimental results, which will facilitate the development of damage suppression methods and the expansion of industrial applications of SiC.

PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY (2021)

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Article Materials Science, Ceramics

Effect of mass transfer channels on flexural strength of C/SiC composites fabricated by femtosecond laser assisted CVI method with optimized laser power

Jing Wang et al.

Summary: The study finds that the femtosecond laser assisted-chemical vapor infiltration (LA-CVI) method is effective in producing C/SiC composites with mass transfer channels, with the increase in laser machining power contributing to the integrity of hole structures. C/SiC composites with different mass transfer channels exhibit significantly improved densification, with flexural strengths reaching up to 546±15MPa, and the enhancement mechanism is mainly attributed to the increased densification and formation of dense band.

JOURNAL OF ADVANCED CERAMICS (2021)

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Article Optics

Water-induced effect on femtosecond laser layered ring trepanning in silicon carbide ceramic sheets using low-to-high pulse repetition rate

Naifei Ren et al.

Summary: The underwater femtosecond laser layered ring trepanning technology shows significant advantages in improving hole-trepanning quality for silicon carbide ceramics, reducing hole-wall oxidation and micro cracks, and enhancing surface uniformity.

OPTICS COMMUNICATIONS (2021)

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Article Optics

Vector scanning subtractive manufacturing technology for laser rapid fabrication

Yi-Ming Lu et al.

Summary: The vector scanning subtractive manufacturing technology proposed in this study enables the rapid fabrication of smooth microoptical components, increasing processing efficiency and reducing the generation of cracks. This technology shows great potential in the field of monolithic integrated 3D all-solid-state micro-optics, allowing flexible fabrication of micro-structures with different sizes and morphologies on materials like sapphire.

OPTICS LETTERS (2021)

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Proceedings Paper Engineering, Manufacturing

High-speed observation of damage generation during ultrashort pulse laser drilling of wide-bandgap materials

Junya Hattori et al.

Summary: This study utilizes pump-probe imaging and a high-speed camera to observe high-speed phenomena during ultrashort pulse laser drilling of wide-bandgap materials, clarifying the mechanism of damage generation. The research contributes to optimizing processing conditions to suppress damage during ultrashort pulse laser processing of wide-bandgap materials.

LASER APPLICATIONS IN MICROELECTRONIC AND OPTOELECTRONIC MANUFACTURING (LAMOM) XXVI (2021)

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Article Optics

O-FIB: far-field-induced near-field breakdown for direct nanowriting in an atmospheric environment

Zhen-Ze Li et al.

LIGHT-SCIENCE & APPLICATIONS (2020)

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Article Materials Science, Ceramics

High speed and low roughness micromachining of silicon carbide by plasma etching aided femtosecond laser processing

Chen Wu et al.

CERAMICS INTERNATIONAL (2020)

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Review Engineering, Manufacturing

A review on conventional and nonconventional machining of SiC particle-reinforced aluminium matrix composites

Ji-Peng Chen et al.

ADVANCES IN MANUFACTURING (2020)

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Article Engineering, Electrical & Electronic

Application of femtosecond laser micromachining in silicon carbide deep etching for fabricating sensitive diaphragm of high temperature pressure sensor

You Zhao et al.

SENSORS AND ACTUATORS A-PHYSICAL (2020)

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Article Multidisciplinary Sciences

Femtosecond laser programmed artificial musculoskeletal systems

Zhuo-Chen Ma et al.

NATURE COMMUNICATIONS (2020)

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Article Optics

Investigations on the ablation behavior of C/SiC under femtosecond laser

Zhaoyang Zhai et al.

OPTIK (2020)

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Article Materials Science, Composites

Water-jet guided laser drilling of SiC reinforced aluminium metal matrix composites

S. Marimuthu et al.

JOURNAL OF COMPOSITE MATERIALS (2019)

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Article Optics

Optical Nanofabrication of Concave Microlens Arrays

Xue-Qing Liu et al.

LASER & PHOTONICS REVIEWS (2019)

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Article Optics

Numerical study of the dynamics of the hole formation during drilling with combined ms and ns laser pulses

Yuan Qin et al.

OPTICS AND LASER TECHNOLOGY (2019)

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Article Chemistry, Physical

Accelerated ICP etching of 6H-SiC by femtosecond laser modification

Yigang Huang et al.

APPLIED SURFACE SCIENCE (2019)

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Article Chemistry, Multidisciplinary

Rapid Engraving of Artificial Compound Eyes from Curved Sapphire Substrate

Xue-Qing Liu et al.

ADVANCED FUNCTIONAL MATERIALS (2019)

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Article Engineering, Electrical & Electronic

UV nanosecond laser machining and characterization for SiC MEMS sensor application

Yunbo Shi et al.

SENSORS AND ACTUATORS A-PHYSICAL (2018)

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Article Chemistry, Analytical

Humidity-responsive actuation of programmable hydrogel microstructures based on 3D printing

Chao Lv et al.

SENSORS AND ACTUATORS B-CHEMICAL (2018)

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Article Materials Science, Multidisciplinary

Effect of beam profile on nanosecond laser drilling of 4H-SIC

Byunggi Kim et al.

JOURNAL OF LASER APPLICATIONS (2018)

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Article Materials Science, Ceramics

Character and mechanism of surface micromachining for C/SiC composites by ultrashort plus laser

J. Wang et al.

ADVANCES IN APPLIED CERAMICS (2017)

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Article Optics

Plasmonic nano-printing: large-area nanoscale energy deposition for efficient surface texturing

Lei Wang et al.

LIGHT-SCIENCE & APPLICATIONS (2017)

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Article Materials Science, Multidisciplinary

Mechanism of nanosecond laser drilling process of 4H-SiC for through substrate vias

Byunggi Kim et al.

APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2017)

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Article Chemistry, Physical

Effect of different parameters on machining of SiC/SiC composites via pico-second laser

Weinan Li et al.

APPLIED SURFACE SCIENCE (2016)

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Article Chemistry, Physical

Structural transformations in femtosecond laser-processed n-type 4H-SiC

Z. U. Rehman et al.

APPLIED SURFACE SCIENCE (2016)

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Article Instruments & Instrumentation

Double nanosecond pulses generation in ytterbium fiber laser

V. P. Veiko et al.

REVIEW OF SCIENTIFIC INSTRUMENTS (2016)

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Article Optics

Effect of surrounding gas condition on surface integrity in micro-drilling of SiC by ns pulsed laser

Yasuhiro Okamoto et al.

APPLIED PHYSICS B-LASERS AND OPTICS (2015)

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Article Chemistry, Physical

Machining parameter optimization of C/SiC composites using high power picosecond laser

Ruoheng Zhang et al.

APPLIED SURFACE SCIENCE (2015)

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Article Materials Science, Multidisciplinary

Simple method for fabrication of microchannels in silicon carbide

Vanthanh Khuat et al.

JOURNAL OF LASER APPLICATIONS (2015)

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Article Materials Science, Multidisciplinary

Picosecond Laser Machining of Deep Holes in Silicon Infiltrated Silicon Carbide Ceramics

Zhang Qing et al.

JOURNAL OF WUHAN UNIVERSITY OF TECHNOLOGY-MATERIALS SCIENCE EDITION (2015)

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Article Engineering, Multidisciplinary

Side lobe suppression of a Bessel beam for high aspect ratio laser processing

Sadao Mori

PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY (2015)

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Review Materials Science, Multidisciplinary

Laser Micromachining of Glass, Silicon, and Ceramics

L. Rihakova et al.

ADVANCES IN MATERIALS SCIENCE AND ENGINEERING (2015)

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Article Physics, Applied

Uniform nano-ripples on the sidewall of silicon carbide micro-hole fabricated by femtosecond laser irradiation and acid etching

Vanthanh Khuat et al.

APPLIED PHYSICS LETTERS (2014)

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Article Chemistry, Physical

Fabrication of through holes in silicon carbide using femtosecond laser irradiation and acid etching

Vanthanh Khuat et al.

APPLIED SURFACE SCIENCE (2014)

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Article Thermodynamics

Optimization of near-infrared laser drilling of silicon carbide under water

Naoki Iwatani et al.

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER (2014)

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Article Engineering, Industrial

Effect of energy density and feeding speed on micro-hole drilling in C/SiC composites by picosecond laser

Yongsheng Liu et al.

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2014)

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Article Materials Science, Multidisciplinary

Ultra-short pulse laser deep drilling of C/SiC composites in air

Chunhui Wang et al.

APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2013)

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Article Thermodynamics

A study of near-infrared nanosecond laser ablation of silicon carbide

Doan Hong Duc et al.

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER (2013)

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Article Engineering, Electrical & Electronic

Fabrication of a guide block for measuring a device with fine pitch area-arrayed solder bumps

Woo-Chang Choi et al.

MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS (2012)

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Article Chemistry, Physical

Circular and rectangular via holes formed in SiC via using ArF based UV excimer laser

L. Liu et al.

APPLIED SURFACE SCIENCE (2011)

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Article Engineering, Industrial

Plasma assisted polishing of single crystal SiC for obtaining atomically flat strain-free surface

K. Yamamura et al.

CIRP ANNALS-MANUFACTURING TECHNOLOGY (2011)

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Article Materials Science, Ceramics

Solvent-Assisted Laser Drilling of Silicon Carbide

Lee Mein Wee et al.

INTERNATIONAL JOURNAL OF APPLIED CERAMIC TECHNOLOGY (2011)

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Review Materials Science, Multidisciplinary

Review of laser microscale processing of silicon carbide

B. Pecholt et al.

JOURNAL OF LASER APPLICATIONS (2011)

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Article Engineering, Electrical & Electronic

A MEMS guide plate for a high temperature testing of a wafer level packaged die wafer

Woo-Chang Choi et al.

MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS (2011)

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Article Materials Science, Multidisciplinary

Fabrication of a void array in dielectric materials by femtosecond laser micro-processing for compact photonic devices

Mitsuhiro Terakawa et al.

APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2010)

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Article Chemistry, Physical

Picosecond pulsed laser ablation and micromachining of 4H-SiC wafers

Pal Molian et al.

APPLIED SURFACE SCIENCE (2009)

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Article Engineering, Industrial

High aspect ratio micro-hole drilling aided with ultrasonic vibration and planetary movement of electrode by micro-EDM

Z. Y. Yu et al.

CIRP ANNALS-MANUFACTURING TECHNOLOGY (2009)

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Review Materials Science, Ceramics

Laser machining of structural ceramics-A review

Anoop N. Samant et al.

JOURNAL OF THE EUROPEAN CERAMIC SOCIETY (2009)

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Article Optics

Alcohol-assisted photoetching of silicon carbide with a femtosecond laser

Cunxia Li et al.

OPTICS COMMUNICATIONS (2009)

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Article Engineering, Electrical & Electronic

Femtosecond-pulsed laser micromachining of a 4H-SiC wafer for MEMS pressure sensor diaphragms and via holes

Yuanyuan Dong et al.

JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2008)

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Article Automation & Control Systems

Ultrafast laser micromachining of 3C-SiC thin films for MEMS device fabrication

Ben Pecholt et al.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2008)

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Review Physics, Applied

SiC sensors: a review

N. G. Wright et al.

JOURNAL OF PHYSICS D-APPLIED PHYSICS (2007)

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Article Chemistry, Physical

Analysis of materials modifications caused by UV laser micro drilling of via holes in AlGaN/GaN transistors on SiC

Tim Wernicke et al.

APPLIED SURFACE SCIENCE (2007)

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Article Nanoscience & Nanotechnology

Theoretical Models and Qualitative Interpretations of Fs Laser Material Processing

Nadezhda M. Bulgakova et al.

JOURNAL OF LASER MICRO NANOENGINEERING (2007)

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Article Materials Science, Multidisciplinary

The characteristics of laser micro drilling using a Bessel beam

Y. Matsuoka et al.

APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2006)

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Article Engineering, Electrical & Electronic

Laser micro machining of 3C-SiC single crystals

S Zoppel et al.

MICROELECTRONIC ENGINEERING (2006)

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Article Materials Science, Multidisciplinary

Thermodynamic pathways to melting, ablation, and solidification in absorbing solids under pulsed laser irradiation

P Lorazo et al.

PHYSICAL REVIEW B (2006)

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Article Engineering, Electrical & Electronic

Comparison of laser-wavelength operation for drilling of via holes in AIGaN/GaN HEMTs on SiC substrates

TJ Anderson et al.

JOURNAL OF ELECTRONIC MATERIALS (2006)

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Article Engineering, Industrial

Parametric studies on pulsed near ultraviolet frequency tripled Nd: YAG laser micromachining of sapphire and silicon

TC Chen et al.

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2005)

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Article Engineering, Electrical & Electronic

Efficient femtosecond laser micromachining of bulk 3C-SiC

M Farsari et al.

JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2005)

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Article Engineering, Electrical & Electronic

SiC via holes by laser drilling

S Kim et al.

JOURNAL OF ELECTRONIC MATERIALS (2004)

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Article Materials Science, Composites

Design, preparation and properties of non-oxide CMCs for application in engines and nuclear reactors: an overview

R Naslain

COMPOSITES SCIENCE AND TECHNOLOGY (2004)

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Article Optics

Laguerre-Gaussian beam generated with a multilevel spiral phase plate for high intensity laser pulses

K Sueda et al.

OPTICS EXPRESS (2004)

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Article Engineering, Industrial

Micro-EDM drilling of tapered holes for industrial applications

C Diver et al.

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2004)

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Article Engineering, Industrial

Laser beam machining (LBM), state of the art and new opportunities

J Meijer

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2004)

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Article Chemistry, Physical

Physical chemistry of the femtosecond and nanosecond laser-material interaction with SiC and a SiC-TiC-TiB2 composite ceramic compound

P Rudolph et al.

APPLIED SURFACE SCIENCE (2003)

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Article Materials Science, Multidisciplinary

Reactive ion etching of novel materials - GaN and SiC

A Szczesny et al.

VACUUM (2003)

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Article Engineering, Electrical & Electronic

Fabrication of SiC microelectromechanical systems using one-step dry etching

LD Jiang et al.

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B (2003)

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Article Physics, Multidisciplinary

Ablation of solids under femtosecond laser pulses

D Perez et al.

PHYSICAL REVIEW LETTERS (2002)

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Article Physics, Multidisciplinary

Surface charging and impulsive ion ejection during ultrashort pulsed laser ablation

R Stoian et al.

PHYSICAL REVIEW LETTERS (2002)

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Progress towards SiC products

CI Harris et al.

APPLIED SURFACE SCIENCE (2001)

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Enhanced drilling using a dual-pulse Nd:YAG laser

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APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2001)

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