期刊
IEEE TRANSACTIONS ON ELECTRON DEVICES
卷 -, 期 -, 页码 -出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2023.3326430
关键词
Analytical model; dielectric breakdown; metal-oxide-semiconductor (MOS); percolation
An analytical approach for calculating the time-to-breakdown of metal-oxide-semiconductor (MOS) systems under different stress conditions is proposed. This method relies solely on fresh I-g V-g measurements and accurately determines the voltage, gate oxide thickness, and temperature dependencies of time-to-breakdown. By comparing these calculated values with experimental data, a comprehensive assessment of the system's performance under various operating conditions can be made. The introduced time-to-breakdown map in the {Temperature-Voltage} space allows for immediate identification of the maximum stress condition for any target lifetime.
We propose an analytical approach for calculating the time-to-breakdown of metal-oxide-semiconductor (MOS) systems under different stress conditions. Our method relies solely on fresh I-g V-g measurements, making it easy to implement. Building on the percolation model and incorporating experimental trends from the literature, we accurately determine the voltage, gate oxide thickness, and temperature dependencies of time-to-breakdown. These calculated values are compared to experimental data under various operating conditions, allowing for a comprehensive assessment. Consequently, we introduce a time-to-breakdown map in the {Temperature-Voltage} space for immediate identification of the maximum stress condition for any target lifetime.
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