☆ 4.7 Review

Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies

JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T (2023)

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Article Acoustics

Microstructure evolution and grain refinement of ultrasonic-assisted soldering joint by using Ni foam reinforced Sn composite solder

Huang He et al.

Summary: Ultrasonic-assisted soldering with a Ni foam reinforced Sn composite solder at 260 degrees C in air resulted in high strength and high melting point Cu connections in 60 s. The addition of Ni foam effectively strengthened the Sn solder and refined the intermetallic compounds (IMCs) grains. Different IMCs were obtained with different porosities of Ni foam. The shear strength of the Cu/Ni60-Sn/Cu joint soldered for 60 s reached 86.9 MPa, with a high melting point and improved crack resistance.

ULTRASONICS SONOCHEMISTRY (2023)

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Article Chemistry, Physical

Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy

Siti Faqihah Roduan et al.

Summary: This paper investigates the influence of a dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. Dimples with a diameter of 50 μm were created by varying the laser scanning repetitions, while the spacing between the dimples was kept constant at 100 μm. The solder joints' wettability, microstructure, and growth of intermetallic compound (IMC) layer were analyzed to assess the impact of the dimple-microtextured copper substrate. Increasing the laser scan repetitions deepened the dimples, resulting in higher surface roughness. The solder joints exhibited decreased contact angle and increased IMC thickness with increasing dimple depth. The copper element was more evenly distributed in the dimple-microtextured copper substrate compared to the non-textured counterpart.

MATERIALS (2023)

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Article Chemistry, Physical

Thermomigration suppression in Sn3.5Ag solder joints by hot-end FeCoNiMn alloy

Yu-An Shen et al.

Summary: Temperature gradient leads to thermomigration in solder joints, which greatly affects their reliability. This study investigates the thermomigration in Cu/Sn3.5Ag/FeCoNiMn solder joints at different temperatures and times. The results show the formation of a multielement intermetallic compound (MEIMC) at the joint interface, which is decomposed by thermomigration from the hot-end FCNM. However, a thickened MEIMC is observed due to rapid thermomigration flux from the hot-end Cu cap. This study suggests FCNM as a promising diffusion barrier for thermomigration in micro solder joints.

INTERMETALLICS (2023)

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Article Engineering, Electrical & Electronic

Influences of rotating magnetic field on microstructure and properties of Sn-Ag-Cu-Sb-Ce solder alloy

Zilong Wang et al.

Summary: The influence of rotating magnetic field (RMF) on the microstructure and properties of Sn-1.0Ag-0.5Cu-0.5Sb-0.07Ce alloy was investigated. XRD, OM, SEM, EDS, DSC, and a universal mechanical testing machine were used to analyze the phase composition, grain size, shape, phase distribution, thermal characteristics, and mechanical properties of the solder. The results showed that RMF refined the size of beta-Sn, transformed the shape of IMCs, decreased layer spacing, slightly reduced the pasty range and melting point of solder, and enhanced its mechanical properties.

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2023)

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Article Chemistry, Physical

The influence of solder oxidation on low-temperature solid-state bonding based on Ni micro-nano cones

Yan Peng et al.

Summary: This paper explores the influence of solder oxidation on bonding based on Ni microcones and finds that solder can still achieve seamless connection with Ni microcones even when there is a thick oxide film on the solder surface. Local plastic deformation induced by microcone tips helps to rupture the oxide layer, thereby overcoming the influence of solder oxidation to a certain extent.

APPLIED SURFACE SCIENCE (2023)

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Article Engineering, Electrical & Electronic

Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn-3.0Ag-0.5Cu solder using 1608 chip capacitor/ENIG joints

Sri Harini Rajendran et al.

Summary: This study investigates the properties of Sn3.5Ag0.5Cu (SAC 305) solder reinforced with high entropy alloy (HEA) particles, showing that the addition of HEA can significantly refine the grain size of the solder, reduce the melting point, and increase strength. After thermal shock testing, the solder with HEA added retained a high shear strength.

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2022)

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Article Engineering, Electrical & Electronic

Highly reliable Cu-Cu low temperature bonding using SAC305 solder with rGO interlayer

Xiang Yin et al.

Summary: This study inhibits the immoderate growth of intermetallic compounds (IMCs) by directly preparing a reduced graphene oxide (rGO) interlayer between copper and Sn-3.0 Ag-0.5 Cu (SAC305) solder, resulting in a highly reliable copper-copper bonding at low temperatures. The copper/rGO/solder bonding structure shows higher shear strength and lower contact resistance compared to the copper/solder bonding structure after aging.

MICROELECTRONICS RELIABILITY (2022)

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Article Engineering, Multidisciplinary

Study on the floating kinetics of graphene in molten Sn-based alloy based on in-situ observation of X-ray radiography

Yuan Li et al.

Summary: In this study, the agglomeration and floating behavior of graphene nanosheets during soldering was investigated, and a transient current bonding technique was proposed to inhibit these phenomena.

COMPOSITES PART B-ENGINEERING (2022)

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Review Materials Science, Multidisciplinary

A review on nanodispersed lead-free solders in electronics: synthesis, microstructure and intermetallic growth characteristics

Mekala Bharath Krupa Teja et al.

Summary: This review provides a comprehensive survey of lead-free solders, their fabrication routes, interfacial reactions, and mechanical properties, with a focus on the potential of nanoparticle-reinforced solders as alternatives and their impact on IMCs.

JOURNAL OF MATERIALS SCIENCE (2022)

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Article Engineering, Electrical & Electronic

Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

T. T. Dele-Afolabi et al.

Summary: The combined effect of MWCNTs and ENIAg surface finish on the microstructure and shear strength of SAC105 solder was investigated. It was found that the addition of MWCNTs resulted in thinner interfacial IMC layer thickness and higher shear strength.

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2022)

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Article Chemistry, Physical

Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow

Nur Syahirah Mohamad Zaimi et al.

Summary: This study investigates the effects of multiple reflow cycles on SAC305-KGC solder joints. The addition of KGC particles suppresses the growth of Cu6Sn5 IMCs and improves the shear strength. The growth direction of Cu6Sn5 IMCs in SAC305 changes with the addition of KGC.

MATERIALS (2022)

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Article Materials Science, Multidisciplinary

Shear deformation behavior and failure mechanisms of graphene reinforced Sn-based solder joints bonded by transient current

Yuan Li et al.

Summary: This study investigates the deformation behavior and mechanisms of graphene nanosheets-reinforced composite solder joints. It is found that the addition of graphene can improve the shear strength of solder joints. The microstructure analysis and calculation suggest that load transfer is the dominant strengthening mechanism for the alloy.

MATERIALS & DESIGN (2022)

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Article Chemistry, Physical

Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes

Hyeokgi Choi et al.

Summary: In the reaction between Pt nanoparticle-alloyed Sn-58Bi solders and ENIG and ENEPIG surface finishes, it is found that Sn-58Bi-0.05Pt/ENEPIG is the optimum combination for preventing the formation and diffusion of intermetallic compounds.

MATERIALS (2022)

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Article Polymer Science

Microstructure and Shear Behaviour of Sn-3.0Ag-0.5Cu Composite Solder Pastes Enhanced by Epoxy Resin

Peng Zhang et al.

Summary: This paper developed novel epoxy-containing composite solder pastes and analyzed the effects of epoxy resin on their spreading performance, microstructure, and shear behavior. The research found that with the addition of epoxy resin, the solder pastes exhibited improved spreadability without altering the microstructure and interfacial morphology of the solder joints. The resin layers formed on the surface of the solder joints during the reflow process enhanced the shear properties.

POLYMERS (2022)

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Article Materials Science, Multidisciplinary

Influence mechanism of Au layer thickness on wettability of Sn-Ag-Cu solder on heated ENIG pads

Jie Wang et al.

Summary: This study investigates the effect of Au layer thickness on the surface morphology, Ni distribution and wettability of Sn-3.0Ag-0.5Cu solder on heated Cu pads with ENIG finish. It is found that Ni diffuses from the Ni layer to the Au surface, reacting with the ambience to form Ni oxides, which inhibit the interfacial reaction and result in barren zones. The size of the barren zones decreases with increasing Au layer thickness.

VACUUM (2022)

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Article Engineering, Industrial

Transient liquid phase bonding (TLPB) of Cu to Cu using Sn interconnect solder reinforced by submicron Al particles

Lei Sun et al.

Summary: This study investigates the effect of submicron Al particles on the properties and microstructure of Sn interconnect solder. The addition of submicron Al particles effectively restrains the growth of interfacial IMC, improves the wettability and mechanical properties of Sn interconnect solder. However, it has little effect on the melting characteristics. The spreading area, shear strength, and microhardness of Sn interconnect solder are significantly improved when 0.3 wt% submicron Al particles are added. Furthermore, the bonding strength of Sn-0.3Al interconnect solder is higher than that of Sn interconnect solder without submicron Al.

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2022)

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Article Materials Science, Coatings & Films

Magnetron sputtering preparation of Cu6Sn5 preferred-orientation coating and its influence on wettability of Sn-based lead-free solder

Zhihang Zhang et al.

Summary: Cu6Sn5 preferred-orientation coatings were prepared on Cu substrates using magnetron sputtering, improving the wettability of Sn-based lead-free solder. The preferred-orientations of the coatings were influenced by sputtering power and substrate temperature. Sn-based lead-free solder exhibited better wettability on (40-2) and (132) Cu6Sn5 coatings, but poorer wettability on (351) Cu6Sn5 coating. Additionally, Sn-based lead-free solder reached wetting stabilized state fastest on (351) Cu6Sn5 coating.

SURFACE & COATINGS TECHNOLOGY (2022)

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Article Materials Science, Ceramics

Highly porous metal organic framework derived NiO hollow spheres and flowers for oxygen evolution reaction and supercapacitors

B. Purusottam Reddy et al.

Summary: Porous NiO hollow spheres and flowers were successfully synthesized through solvothermal synthesis and heat treatment, exhibiting excellent supercapacitive performance and catalytic activity. The hollow spheres showed higher specific capacitance and lower overpotential compared to the flowers, with over 93% capacity retention after 5000 cycles.

CERAMICS INTERNATIONAL (2021)

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Article Engineering, Manufacturing

The formation of intermetallic layer structure of SAC405/Cu and SAC405/ENImAg solder joint interfaces

Rabiatul Adawiyah Mohamed Anuar et al.

Summary: The study aimed to investigate the effects of different surface finishes on soldering and ageing process. The results showed that the ENImAg surface finish exhibited better performance in terms of shear strength and IMC layer thickness compared to bare Cu.

SOLDERING & SURFACE MOUNT TECHNOLOGY (2021)

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Review Materials Science, Multidisciplinary

Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review

Mu-lan Li et al.

Summary: Researchers utilize nanoparticles to enhance the performance of solder joints, resulting in refined matrix, improved wetting ability, and strengthened mechanical performance of the solder. The size and content of particles influence the structure and properties of the solder, while nanoparticles impact melting temperature, wetting ability, creep behaviors, electromigration properties, etc.

MATERIALS & DESIGN (2021)

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Article Engineering, Electrical & Electronic

Influence of porous Cu interlayer on the intermetallic compound layer and shear strength of MWCNT-reinforced SAC 305 composite solder joints

M. A. Azmah Hanim et al.

Summary: The study investigated the synergetic effect of multi-walled carbon nanotubes (MWCNTs) and porous Cu interlayer (PCI) on the intermetallic compound (IMC) formation and shear strength in the SAC 305 solder system. It was found that the presence of PCI inhibited IMC layer formation and enhanced the shear strength of the composite solder joints. The PCI material significantly improved the performance of the solder joints, particularly in the SAC-0.01CNT-xPCI series.

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2021)

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Article Engineering, Electrical & Electronic

Microstructure and mechanical behavior of SnBi-xAg and SnBi-xAg@P-Cu solder joints during isothermal aging

Yang Liu et al.

Summary: The addition of porous Cu improves the microstructure and hardness of the SnBi-xAg@P-Cu/Cu solder joints, leading to an increase in hardness and coarsening of the microstructure after aging. Among them, SnBi-0.4Ag@P-Cu/Cu shows the highest shear strength.

MICROELECTRONICS RELIABILITY (2021)

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Article Engineering, Electrical & Electronic

Comparative study between the Sn-Ag-Cu/ENIG and Sn-Ag-Cu/ENEPIG solder joints under extreme temperature thermal shock

Ruyu Tian et al.

Summary: The study investigated the interfacial reactions, growth behavior of IMCs, and their effects on the mechanical properties of SAC305/ENEPIG and SAC305/ENIG solder joints under extreme temperature thermal shock. The results showed that the growth rate of IMCs in SAC305/ENEPIG joints was slower due to the inhibitory effect of the Pd(P) layer on the surface finish, resulting in higher shear force after thermal shock.

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2021)

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Article Engineering, Electrical & Electronic

Novel low Ag-content Sn-Ag-Cu-Sb-Al solder alloys with enhanced elastic compliance and plastic energy dissipation ability by applying rotating magnetic field

A. M. El-Taher et al.

Summary: This research investigates the impact of rotating magnetic field (RMF) on the physical properties of the SAC0505SbAl solder alloy, revealing that RMF can change the morphology, thermal properties, and significantly increase the ductility of the alloy. The findings of this study help fill the knowledge gap about the behavior of these recently developed solder alloys under the effect of RMF.

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2021)

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Article Chemistry, Physical

Self-Fluxing Mechanism in Geopolymerization for Low-Sintering Temperature of Ceramic

Noorina Hidayu Jamil et al.

Summary: The study utilized kaolin as a source of aluminosilicate materials for geopolymerization, with the addition of ground granulated blast furnace slag accelerating the process. Sintering at 900 degrees Celsius yielded the highest compressive strength in the prepared kaolin-GGBS geopolymer. The difference in X-ray absorption near edge structure spectra was associated with phases identified through X-ray diffraction analysis.

MATERIALS (2021)

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Article Chemistry, Physical

Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing

Nur Syahirah Mohamad Zaimi et al.

Summary: This study investigated the effect of isothermal ageing on SAC305 solder with kaolin geopolymer ceramic reinforcement particles, showing that the addition of KGC improved the total thickness of the IMC layer. The growth and morphology of the IMC layer during ageing were controlled by bulk and grain-boundary diffusion processes, with higher activation energies observed for the total IMC layer and Cu3Sn IMC in the composite solder. Meanwhile, the SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder, with a combination of brittle and ductile failure modes observed at higher ageing temperatures and times.

MATERIALS (2021)

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Article Electrochemistry

Uniform lithium plating within 3D Cu foam enabled by Ag nanoparticles

Zi-Wei Zhu et al.

Summary: Lithium metal is considered the Holy Grail of anode materials for high-energy-density batteries, but its instability hinders its application, especially during the large-capacity lithium stripping/plating process. A dimensionally stable Li composite electrode fabricated by electrodepositing lithium on Ag-modified Cu foam shows improved stability and promotes uniform Li stripping/plating on the Cu skeleton. However, the interface stability of the Li composite electrode deteriorates with an increase in specific surface area.

ELECTROCHIMICA ACTA (2021)

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Article Chemistry, Physical

Growth of the nano-phase intermetallic compounds and its effect on mechanical behavior of Au80Sn20/CrMnFeCoNi solder joints during isothermal aging

Xiao Liu et al.

Summary: The study investigated the microstructure and mechanical properties of aged Au80Sn20/CrMnFeCoNi solder joints. Results showed an increase in intermetallic compound thickness and size of Co3Fe7 nanoparticles with extended aging time, while Vickers hardness and shear strength continuously decreased.

JOURNAL OF ALLOYS AND COMPOUNDS (2021)

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Review Surgery

The PRISMA 2020 statement: An updated guideline for reporting systematic reviews

Matthew J. Page et al.

Summary: The PRISMA 2020 statement, an updated version of the 2009 statement, includes new reporting guidance that reflects advances in research methods. This article introduces the PRISMA 2020 27-item checklist and related information.

INTERNATIONAL JOURNAL OF SURGERY (2021)

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Article Engineering, Manufacturing

Study on the microstructure and mechanical property of Cu-foam modified Sn3.0Ag0.5Cu solder joints by ultrasonic-assisted soldering

Xiong Yi et al.

Summary: The study investigated the effects of Cu-foam sheets and ultrasound-assisted soldering time on the microstructure and mechanical properties of solder joints. Results showed that the grain refinement caused by ultrasonic cavitation significantly improved the shear strength of the solder joints, and changed the fracture behavior of solder joints.

JOURNAL OF MANUFACTURING PROCESSES (2021)

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Article Chemistry, Physical

Extremely thin interlayer of multi-element intermetallic compound between Sn-based solders and FeCoNiMn high-entropy alloy

Yu-An Shen et al.

Summary: The study found that FCNM has better contact angles and diffusion rates with SAC305 and SB58, along with low dissolution rate and extremely thin interlayer, making it a promising material for diffusion barrier in three-dimensional integrated circuits with small solder volumes.

APPLIED SURFACE SCIENCE (2021)

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Article Engineering, Electrical & Electronic

Pressure-assisted soldering of copper using porous metal-reinforced Sn58Bi solder

Yang Liu et al.

Summary: Porous metals (Ni, Cu) were added into SnBi solder joint to obtain composite solder joints, and the microstructure and shear behavior were investigated under different porosity conditions. The addition of porous metals significantly increased the shear strength of the SnBi solder joint, with the highest shear strength observed in SnBi@110P-Cu solder joint.

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2021)

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Article Nanoscience & Nanotechnology

Mechanical behaviors of lotus-type porous Cu/Cu joint soldered by Sn-3.0Ag-0.5Cu alloy

Sang-Wook Kim et al.

Summary: Porous Cu joints with cylindrical pore aligned in a single direction were successfully joined to Cu substrate using Sn-3.0Ag-0.5Cu solder. The joint strength of porous Cu joints was weaker but had higher ductility compared to non-porous Cu joints, being further enhanced under tensile mode. Additionally, energy absorption ability was improved in porous Cu joints, and the pore structure at joint interface played a role in delaying crack propagation.

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2021)

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Article Materials Science, Multidisciplinary

Shear analysis of rice husk ash (RHA) reinforced tin-0.7-copper composite solders on electroless nickel/immersion silver (ENIAg) surfacesScheranalyse von mit Reisschalenasche verstarktem Zinn (0,7)-Kupfer-Verbundlotwerkstoff auf chemisch Nickel/chemisch Silber (ENIAg)-Oberflachen

M. A. Azmah Hanim et al.

Summary: The mechanical performance of the rice husk ash-reinforced tin-0.7 copper composite solder was investigated in this study. The results showed that the inclusion of rice husk ash did not enhance the shear strength, with the plain solder exhibiting the highest shear strength.

MATERIALWISSENSCHAFT UND WERKSTOFFTECHNIK (2021)

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Article Metallurgy & Metallurgical Engineering

Effect of transient current bonding on interfacial reaction in Ag-coated graphene Sn-Ag-Cu composite solder joints

Yong-dian Han et al.

Summary: The Cu/SAC/Ag-GNSs/Cu sandwich joints prepared under applied current density showed homogeneous dispersion of Ag-GNSs, providing more nucleation sites and refining grains, leading to enhanced shear strength and changes in fracture mechanism.

TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA (2021)

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Article Materials Science, Multidisciplinary

Improvement on the mechanical properties of eutectic Sn58Bi alloy with porous Cu addition during isothermal aging

Yang Liu et al.

Summary: The study compared the microstructure, interfacial IMC layer, shear behavior, and hardness of Sn58Bi, SnBi@110P-Cu/Cu, and SnBi@500P-Cu/Cu solder joints during isothermal aging. The addition of porous Cu can suppress void formation at the soldering interface and improve shear strength during aging, with SnBi@500P-Cu/Cu joints showing the highest shear strength before and after aging.

MATERIALS RESEARCH EXPRESS (2021)

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Article Materials Science, Multidisciplinary

Progress on microstructure features and creep properties of prospective Tin-Silver-Zinc alloy using a magnetic field

A. E. Hammad et al.

Summary: The use of a rotating magnetic field (RMF) in the current work is shown to be an innovative method to improve microstructure features and creep resistance of the SAZ alloy. The results demonstrate that applying RMF does not change the composition of intermetallic compounds (IMCs), but it does lead to microstructure refinement and homogeneous distribution of IMCs in the alloy. Additionally, the RMF-treated SAZ alloy (SAZ-B) exhibits significantly improved creep resistance and longer creep rupture time compared to the untreated alloy, indicating potential for enhanced industrial performance.

MATERIALS RESEARCH EXPRESS (2021)

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Article Materials Science, Multidisciplinary

Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

K. Vidyatharran et al.

Summary: This study investigated the combined effect of graphene nanosheets (GNSs) and Electroless Nickel Immersion Silver (ENIAg) surface finish on the formation of intermetallic compounds (IMCs) and shear strength of the solder system. The addition of GNSs and ENIAg surface finish resulted in a significant reduction in the thickness of the interfacial IMC layer. The GNSs showed promising potential in enhancing the shear strength of the solder joints.

JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T (2021)

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Article Engineering, Manufacturing

Stress analysis and structural optimization of 3-D IC package based on the Taguchi method

Ming-Yue Xiong et al.

SOLDERING & SURFACE MOUNT TECHNOLOGY (2020)

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Article Metallurgy & Metallurgical Engineering

Brazing of porous copper foam/copper with amorphous Cu-9.7Sn-5.7Ni-7.0P (wt%) filler metal: interfacial microstructure and diffusion behavior

Nur Amirah Mohd Zahri et al.

WELDING IN THE WORLD (2020)

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Article Engineering, Electrical & Electronic

Fabrication of Nanoporous Cu Sheet and Application to Bonding for High-Temperature Applications

Shunichi Koga et al.

JOURNAL OF ELECTRONIC MATERIALS (2020)

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Article Engineering, Electrical & Electronic

Inhibition of intermetallic compounds growth at Sn-58Bi/Cu interface bearing CuZnAl memory particles (2-6 μm)

Liang Zhang et al.

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2020)

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Article Materials Science, Multidisciplinary

In-situ observation of fluxless soldering of Sn-3.0Ag-0.5Cu/Cu under a formic acid atmosphere

Siliang He et al.

MATERIALS CHEMISTRY AND PHYSICS (2020)

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Article Nanoscience & Nanotechnology

Ultrasonic bonding of 2024 Al alloy using Ni-foam/Sn composite solder at ambient temperature

Wanli Niu et al.

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2020)

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Article Materials Science, Multidisciplinary

Influences of Ni addition into Cu-xNi alloy on the microstructure evolution and mechanical property of Sn-58Bi/Cu-xNi solder joint

Jinxuan Cheng et al.

APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2020)

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Article Physics, Applied

Effects of nanoparticles on properties and interface reaction of Sn solder for microelectronic packaging

Meng Zhao et al.

INTERNATIONAL JOURNAL OF MODERN PHYSICS B (2020)

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Article Engineering, Manufacturing

Effect of external magnetic field on resistance spot welding of aluminum alloy AA6061-T6

Ming Huang et al.

JOURNAL OF MANUFACTURING PROCESSES (2020)

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Article Materials Science, Multidisciplinary

The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering

M. I. I. Ramli et al.

MATERIALS & DESIGN (2020)

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Article Engineering, Industrial

Effect of addition of CuZnAl particle on the properties of Sn solder joint

Lei Sun et al.

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2020)

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Article Engineering, Electrical & Electronic

Microstructure, mechanical, and thermal behaviors of SnBi/Cu solder joint enhanced by porous Cu

Yang Liu et al.

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2020)

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Article Engineering, Electrical & Electronic

Microstructural and shear strength properties of RHA-reinforced Sn-0.7Cu composite solder joints on bare Cu and ENIAg surface finish

M. A. Azmah Hanim et al.

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2020)

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Article Materials Science, Multidisciplinary

New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints

Peng Zhang et al.

MATERIALS & DESIGN (2020)

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Review Chemistry, Physical

Recent advances in metal oxide/hydroxide on three-dimensional nickel foam substrate for high performance pseudocapacitive electrodes

Raphael M. Obodo et al.

CURRENT OPINION IN ELECTROCHEMISTRY (2020)

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Article Materials Science, Multidisciplinary

Effect of porous Cu addition on the microstructure and mechanical properties of SnBi-xAg solder joints

Yang Liu et al.

APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2020)

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Article Materials Science, Multidisciplinary

Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrateEinfluss von mehrfach Ruckfluss bei intermetallischen Verbindungen von Nickel-dotiertem Zinn-Silber-Kupfer auf Substrat mit Chemisch-Silber-Schicht

M. A. Rabiatul Adawiyah et al.

MATERIALWISSENSCHAFT UND WERKSTOFFTECHNIK (2020)

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Article Engineering, Electrical & Electronic

Microstructure evolution and hardness of MWCNT-reinforced Sn-5Sb/Cu composite solder joints under different thermal aging conditions

T. T. Dele-Afolabi et al.

MICROELECTRONICS RELIABILITY (2020)

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Article Engineering, Electrical & Electronic

Achieving microstructure refinement and superior mechanical performance of Sn-2.0Ag-0.5Cu-2.0Zn (SACZ) solder alloy with rotary magnetic field

A. E. Hammad et al.

MICROELECTRONICS RELIABILITY (2020)

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Article Materials Science, Multidisciplinary

The role of foam on microstructure and strength of the brazed C/C composites/Ti6Al4V alloy joint

Wei Guo et al.

VACUUM (2020)

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Article Engineering, Environmental

Synthesis of CuO@CoNi LDH on Cu foam for high-performance supercapacitors

Feng Chen et al.

CHEMICAL ENGINEERING JOURNAL (2020)

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Article Chemistry, Physical

Improvement of thermomigration resistance in lead-free Sn3.5Ag alloys by Ag interlayer

Yu-Fang Lin et al.

JOURNAL OF ALLOYS AND COMPOUNDS (2020)

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Article Chemistry, Physical

Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam

Huang He et al.

JOURNAL OF ALLOYS AND COMPOUNDS (2020)

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Article Materials Science, Multidisciplinary

Diffusion reaction-induced microstructure and strength evolution of Cu joints bonded with Sn-based solder containing Ni-foam

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MATERIALS LETTERS (2020)

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Article Materials Science, Multidisciplinary

Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging

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JOURNAL OF MATERIALS SCIENCE (2019)

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Article Materials Science, Multidisciplinary

The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn-4.0 Ag-0.5Cu/ENImAg

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MATERIALWISSENSCHAFT UND WERKSTOFFTECHNIK (2019)

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Article Materials Science, Multidisciplinary

Improved Reliability and Mechanical Performance of Ag Microalloyed Sn58Bi Solder Alloys

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METALS (2019)

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Review Chemistry, Multidisciplinary

Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

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APPLIED SCIENCES-BASEL (2019)

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Article Chemistry, Physical

Isothermal aging and shear creep behavior of a novel lead-free solder joint with small additions of Bi, Sb and Ni

Q. B. Tao et al.

JOURNAL OF ALLOYS AND COMPOUNDS (2019)

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Article Engineering, Electrical & Electronic

Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles

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JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2019)

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Article Engineering, Electrical & Electronic

Interconnection method based on solder-filled nanoporous copper as interlayer for high-temperature applications

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MICROELECTRONIC ENGINEERING (2019)

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Article Multidisciplinary Sciences

Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging

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SCIENTIFIC REPORTS (2019)

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Article Physics, Applied

Cu-Cu low temperature bonding based on lead-free solder with graphene interlayer

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APPLIED PHYSICS LETTERS (2019)

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Article Engineering, Electrical & Electronic

Advancement solidification microstructure and mechanical properties of Sn-2.0Ag-0.5Cu alloy by applying a rotary magnetic field

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JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2019)

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Article Chemistry, Physical

Impact of different isothermal aging conditions on the IMC layer growth and shear strength of MWCNT-reinforced Sn-5Sb solder composites on Cu substrate

T. T. Dele-Afolabi et al.

JOURNAL OF ALLOYS AND COMPOUNDS (2019)

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Article Materials Science, Coatings & Films

Correlation between microstructure and corrosion behaviour of SnBi-graphene oxide composite coatings

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SURFACE & COATINGS TECHNOLOGY (2019)

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Article Materials Science, Multidisciplinary

Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints

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METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE (2019)

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Effect of foam copper interlayer on the mechanical properties and fretting wear of sandwich clinched joints

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JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2019)

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Article Chemistry, Multidisciplinary

Low-Temperature Copper Bonding Strategy with Graphene Interlayer

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ACS NANO (2018)

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Article Chemistry, Physical

Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints

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JOURNAL OF ALLOYS AND COMPOUNDS (2018)

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Article Chemistry, Physical

Assessment of room-temperature short-term stress relaxation and strain relaxation with recovery in Sn-Bi lead-free solders solidified under rotating magnetic field

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JOURNAL OF ALLOYS AND COMPOUNDS (2018)

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Article Chemistry, Physical

Influence of dual ceramic nanomaterials on the solderability and interfacial reactions between lead-free Sn-Ag-Cu and a Cu conductor

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JOURNAL OF ALLOYS AND COMPOUNDS (2018)

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Microstructural and mechanical behavior of SnCu-Ge solder alloy subjected to high temperature storage

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JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2018)

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The structure of geopolymers - Theoretical studies

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JOURNAL OF MOLECULAR STRUCTURE (2018)

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Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints

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MATERIALS RESEARCH BULLETIN (2018)

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Article Nanoscience & Nanotechnology

Microstructure and mechanical properties of 7075-Al alloy joint ultrasonically soldered with Ni-foam/Sn composite solder

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Influence of rotating magnetic field on solidification microstructure and tensile properties of Sn-Bi lead-free solders

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MICROELECTRONICS RELIABILITY (2018)

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A Modular Solder System with Hierarchical Morphology and Backward Compatibility

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SMALL (2018)

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Ultrasonic soldering of Cu alloy using Ni-foam/Sn composite interlayer

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ULTRASONICS SONOCHEMISTRY (2018)

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Article Chemistry, Physical

Design and Properties of New Lead-Free Solder Joints Using Sn-3.5Ag-Cu Solder

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SILICON (2018)

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Article Materials Science, Multidisciplinary

Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates

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RESULTS IN PHYSICS (2018)

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Article Materials Science, Multidisciplinary

Enhanced shear strength of Cu-Sn intermetallic interconnects with interlocking dendrites under fluxless electric current-assisted bonding process

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JOURNAL OF MATERIALS SCIENCE (2017)

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Article Chemistry, Physical

Evolution of microstructure and mechanical properties of Cu/SAC305/Cu solder joints under the influence of low ultrasonic power

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Article Materials Science, Multidisciplinary

MOF-templated thermolysis for porous CuO/Cu2O@CeO2 anode material of lithium-ion batteries with high rate performance

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JOURNAL OF MATERIALS SCIENCE (2017)

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Article Materials Science, Multidisciplinary

The effect of temperature on the formation behavior of reaction layer in Sn-3.0Ag-0.5Cu solder joint with the addition of porous Copper interlayer

J. Nashrah Hani et al.

MATERIALWISSENSCHAFT UND WERKSTOFFTECHNIK (2017)

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Article Materials Science, Multidisciplinary

Interfacial reaction between SAC305 lead-free solders and ENImAg surface finish and bare copper

M. A. Rabiatul Adawiyah et al.

MATERIALWISSENSCHAFT UND WERKSTOFFTECHNIK (2017)

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Review Chemistry, Multidisciplinary

Nanostructured materials on 3D nickel foam as electrocatalysts for water splitting

Nitin K. Chaudhari et al.

NANOSCALE (2017)

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Article Materials Science, Multidisciplinary

Microstructural evolution and properties of TLP diffusion bonding super-Ni/NiCr laminated composite to Ti-6Al-4V alloy with Cu interlayer

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MATERIALS & DESIGN (2017)

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Article Materials Science, Multidisciplinary

Reinforcement of graphene nanosheets on the microstructure and properties of Sn58Bi lead-free solder

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MATERIALS & DESIGN (2017)

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Article Materials Science, Multidisciplinary

Microstructure evolution of diffusion welded 304L/Zircaloy4 with copper interlayer

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MATERIALS & DESIGN (2017)

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Proceedings Paper Engineering, Manufacturing

Solder Volume Effect on Interfacial Reaction between Sn-Ag-Cu/ENImAg Substrate

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ADVANCES IN MATERIAL & PROCESSING TECHNOLOGIES CONFERENCE (2017)

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Formation of one-part-mixing geopolymers and geopolymer ceramics from geopolymer powder

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Porous metal model for calculating slot thermal conductivity coefficient of electric machines

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APPLIED THERMAL ENGINEERING (2017)

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Solidification of pure aluminium affected by a pulsed electrical field and electromagnetic stirring

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JOURNAL OF MATERIALS SCIENCE (2016)

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Study of Cu, Cu-Ni and Rh-modified Cu porous layers as electrode materials for the electroanalysis of nitrate and nitrite ions

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JOURNAL OF SOLID STATE ELECTROCHEMISTRY (2016)

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Article Nanoscience & Nanotechnology

Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene

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ACS APPLIED MATERIALS & INTERFACES (2016)

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Activation of electroplated-Cu surface via plasma pretreatment for low temperature Cu-Sn bonding in 3D interconnection

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APPLIED SURFACE SCIENCE (2016)

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Article Metallurgy & Metallurgical Engineering

Dependency of structure, mechanical and electrical properties on rotating magnetic field in the Bi-Sn-Ag ternary eutectic alloy

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INTERNATIONAL JOURNAL OF MATERIALS RESEARCH (2016)

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Article Chemistry, Physical

Extremely fast formation of Cu-Sn intermetallic compounds in Cu/Sn/Cu system via a micro-resistance spot welding process

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Article Engineering, Electrical & Electronic

Comparative study of the microstructure and mechanical strength of tin-copper (Sn0.7Cu) solder modified with silver (Ag) by both alloying and doping methods

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JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2016)

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Article Engineering, Electrical & Electronic

Sn-3.0Ag-0.5Cu nanocomposite solders reinforced by graphene nanosheets

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JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2016)

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Article Nanoscience & Nanotechnology

Effects of Ni addition on mechanical properties of Sn58Bi solder alloy during solid-state aging

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MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2016)

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Effect of Trace Ge on Wettability and High-Temperature Oxidation Resistance of Sn-0.7Cu Lead-Free Solder

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MATERIALS TRANSACTIONS (2016)

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Article Materials Science, Multidisciplinary

Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint

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METALS (2016)

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Article Materials Science, Multidisciplinary

Effect of permanent magnet stirring on solidification of Sn-Pb alloy

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MATERIALS & DESIGN (2016)

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Experimental evaluation onto the damping behavior of Al/SiC/RHA hybrid composites

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Inhibiting CoSn3 growth at the Sn/Co system by minor Zn addition

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INTERMETALLICS (2015)

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Article Engineering, Mechanical

Influences of Exothermic Reactive Layer and Metal Interlayer on Fracture Behavior of Reactively Bonded Solder Joints

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JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME (2015)

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Impact of melt convection induced by ultrasonic wave on dendrite growth in Sn-Bi alloys

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MATERIALS LETTERS (2015)

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Article Engineering, Multidisciplinary

Microstructural characteristics, mechanical and wear behaviour of aluminium matrix hybrid composites reinforced with alumina, rice husk ash and graphite

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ENGINEERING SCIENCE AND TECHNOLOGY-AN INTERNATIONAL JOURNAL-JESTECH (2015)

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Article Chemistry, Physical

Microstructural evolution at Cu/Sn-Ag-Cu/Cu and Cu/Sn-Ag-Cu/Ni-Au ball grid array interfaces during thermal ageing

V. M. F. Marques et al.

JOURNAL OF ALLOYS AND COMPOUNDS (2014)

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Article Engineering, Electrical & Electronic

Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy

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JOURNAL OF ELECTRONIC MATERIALS (2014)

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Article Computer Science, Artificial Intelligence

Process optimization of SnCuNi soldering material using artificial parametric design

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JOURNAL OF INTELLIGENT MANUFACTURING (2014)

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Article Engineering, Electrical & Electronic

Enhanced reliability of Sn-Ag-Bi-In joint under electric current stress by adding Co/Ni elements

Youngseok Kim et al.

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2014)

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Vacuum brazing of sapphire with Inconel 600 using Cu/Ni porous composite interlayer for gas pressure sensor application

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MATERIALS & DESIGN (2014)

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Article Nanoscience & Nanotechnology

Preparation of density-graded aluminum foam

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MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2014)

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Hybrid composites - a better choice for high wear resistant materials

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JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T (2014)

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Proceedings Paper Materials Science, Multidisciplinary

Formation behaviour of reaction layer in Sn-3.0Ag-0.5Cu solder joint with addition of porous Cu interlayer

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INTERNATIONAL SYMPOSIUM ON INTERFACIAL JOINING AND SURFACE TECHNOLOGY (IJST2013) (2014)

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Low-temperature solid state bonding method based on surface Cu-Ni alloying microcones

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APPLIED SURFACE SCIENCE (2013)

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Comparison of static contact angle of various metal foams and porous copper fiber sintered sheet

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APPLIED SURFACE SCIENCE (2013)

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Article Materials Science, Multidisciplinary

Effects of phosphorus addition on the properties of Sn-9Zn lead-free solder alloy

Hui-zhen Huang et al.

INTERNATIONAL JOURNAL OF MINERALS METALLURGY AND MATERIALS (2013)

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Article Engineering, Electrical & Electronic

Retarding Electromigration in Lead-Free Solder Joints by Alloying and Composite Approaches

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JOURNAL OF ELECTRONIC MATERIALS (2013)

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Article Engineering, Electrical & Electronic

Effect of Ag Content and the Minor Alloying Element Fe on the Mechanical Properties and Microstructural Stability of Sn-Ag-Cu Solder Alloy Under High-Temperature Annealing

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JOURNAL OF ELECTRONIC MATERIALS (2013)

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Article Engineering, Electrical & Electronic

Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect

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JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2013)

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Article Engineering, Electrical & Electronic

Influence of Cr alloying on the oxidation resistance of Sn-8Zn-3Bi solders

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JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2013)

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Article Nanoscience & Nanotechnology

Effect of graphene nanosheets reinforcement on the performance of Sn-Ag-Cu lead-free solder

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MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2013)

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Article Nanoscience & Nanotechnology

Influence of a high magnetic field on the microstructure and properties of a Cu-Fe-Ag in situ composite

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MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2013)

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Article Materials Science, Multidisciplinary

Effect of indium addition on the microstructural formation and soldered interfaces of Sn-2.5Bi-1Zn-0.3Ag lead-free solder

Ming-jie Dong et al.

INTERNATIONAL JOURNAL OF MINERALS METALLURGY AND MATERIALS (2012)

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Article Crystallography

Flow oscillations driven by a rotating magnetic field in liquid metal columns with an upper free surface

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JOURNAL OF CRYSTAL GROWTH (2012)

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Theoretical study and pathways for nanoparticle capture during solidification of metal melt

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JOURNAL OF PHYSICS-CONDENSED MATTER (2012)

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Article Engineering, Electrical & Electronic

The effect of adding Ni and Ge microelements on the electromigration resistance of low-Ag based SnAgCu solder

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MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS (2012)

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Interfacial morphologies and possible mechanisms of a novel low temperature insertion bonding technology based on micro-nano cones array

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MATERIALS LETTERS (2012)

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Article Chemistry, Multidisciplinary

Oxidation Resistance of Graphene-Coated Cu and Cu/Ni Alloy

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ACS NANO (2011)

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Electrical conductivity maps in graphene nanoplatelet/silicon nitride composites using conducting scanning force microscopy

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CARBON (2011)

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Preparation of graphene nanosheet/alumina composites by spark plasma sintering

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MATERIALS RESEARCH BULLETIN (2011)

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Article Chemistry, Physical

Preparation and electrical properties of graphene nanosheet/Al2O3 composites

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CARBON (2010)

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Article Engineering, Electrical & Electronic

Electromigration in Sn-Bi Modified with Polyhedral Oligomeric Silsesquioxane

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JOURNAL OF ELECTRONIC MATERIALS (2010)

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Article Materials Science, Multidisciplinary

Effect of Formic Acid Surface Modification on Bond Strength of Solid-State Bonded Interface of Tin and Copper

Shinji Koyama et al.

MATERIALS TRANSACTIONS (2010)

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Article Chemistry, Physical

A new application for nickel foam in alkaline fuel cells

F. Bidault et al.

INTERNATIONAL JOURNAL OF HYDROGEN ENERGY (2009)

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Article Chemistry, Physical

Effects of multiple reflows on interfacial reaction and shear strength of SnAgCu and SnPb solder joints with different PCB surface finishes

Ping Liu et al.

JOURNAL OF ALLOYS AND COMPOUNDS (2009)

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Article Materials Science, Multidisciplinary

Electromigration behaviors in Sb particle-reinforced composite eutectic SnAgCu solder joints

Fu Guo et al.

JOURNAL OF MATERIALS SCIENCE (2009)

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Article Nanoscience & Nanotechnology

Joining ceramics to metals using metallic foam

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MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2008)

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Mechanical properties of a density-graded replicated aluminum foam

Alan H. Brothers et al.

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2008)

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Article Engineering, Mechanical

Mechanical and physical characterization of copper foam

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International Journal of Mechanics and Materials in Design (2008)

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Oxidation behavior of molten tin doped with phosphorus

Ai-Ping Xian et al.

JOURNAL OF ELECTRONIC MATERIALS (2007)

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Article Chemistry, Physical

Effect of the metal foam materials on the performance of methanol steam micro-reformer for fuel cells

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APPLIED CATALYSIS A-GENERAL (2007)

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Article Chemistry, Physical

The rise of graphene

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NATURE MATERIALS (2007)

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Article Thermodynamics

Control of macro segregation during the solidification of alloys using magnetic fields

Deep Samanta et al.

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER (2006)

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Article Materials Science, Multidisciplinary

Thermal oxidation study on lead-free solders of Sn-Ag-Cu and Sn-Ag-Cu-Ge

SW Cho et al.

ADVANCED ENGINEERING MATERIALS (2006)

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Article Chemistry, Physical

Interfacial reactions between Sn-0.4Cu solder and Cu substrate with or without ENIG plating layer during reflow reaction

JW Yoon et al.

JOURNAL OF ALLOYS AND COMPOUNDS (2005)

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Article Crystallography

Two kinds of magnetic fields induced by one pair of rotating permanent magnets and their application in stirring and controlling molten metal flows

X. D. Wang et al.

JOURNAL OF CRYSTAL GROWTH (2005)

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Article Engineering, Electrical & Electronic

Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applications

M Arra et al.

JOURNAL OF ELECTRONIC MATERIALS (2004)

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Article Engineering, Electrical & Electronic

Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn interlayers

MW Liang et al.

JOURNAL OF ELECTRONIC MATERIALS (2003)

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Article Engineering, Electrical & Electronic

Effects of intermetallic morphology at the metallic particle solder interface on mechanical properties of Sn-Ag-based solder joints

H Rhee et al.

JOURNAL OF ELECTRONIC MATERIALS (2003)

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Article Mechanics

Stability of axially symmetric flow driven by a rotating magnetic field in a cylindrical cavity

I Grants et al.

JOURNAL OF FLUID MECHANICS (2001)

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