期刊
JOURNAL OF CLEANER PRODUCTION
卷 429, 期 -, 页码 -出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.jclepro.2023.139570
关键词
Semiconductor wastewater; Chemical and mechanical polishing (CMP); wastewater; Wastewater treatment; Wastewater reuse
With the development of semiconductor production, semiconductor wastewater has become an emerging issue due to its severe toxicity and complexity. This review discusses various treatment processes, including physical, chemical, biological, and hybrid or combined processes, to remove and degrade the chemicals commonly used in semiconductor fabrication. Understanding the characteristics, efficiency, effect factors, and limitations of these processes is crucial for proper semiconductor wastewater treatment. The review also proposes future trends in the treatment process to minimize the semiconductor wastewater problem.
Semiconductor wastewater has recently become an emerging issue with the development of semiconductor production owing to its severe toxicity and complexity. The increasing amount of semiconductor wastewater generated and discharged and the use of various chemicals in the semiconductor fabrication process highlight the necessity and importance of semiconductor wastewater treatment. This review describes various physical, chemical, biological, and hybrid or combined processes. These processes have been developed to remove and degrade fluoride, nitrogen, phosphate, turbidity, and organic compounds, including photoresist and washing solutions that are generally used in semiconductor fabrication. To properly treat semiconductor wastewater, understanding the characteristics, efficiency, effect factors, and limitations of the process is necessary. This review proposes future trends in the treatment process that can help minimize the semiconductor wastewater problem.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据