期刊
MATERIALS FOR QUANTUM TECHNOLOGY
卷 3, 期 4, 页码 -出版社
IOP Publishing Ltd
DOI: 10.1088/2633-4356/ad0aa5
关键词
atomic layer deposition; superconducting thin films; niobium nitride; superconducting quantum detectors; quantum photonics
This study reports the growth of highly uniform superconducting NbN thin films using plasma-enhanced atomic layer deposition (PEALD) with radio frequency substrate biasing. The films exhibit properties close to that of bulk materials and low suppression effects. PEALD could be a pivotal technique for large-scale fabrication of integrated quantum photonic devices.
Atomic layer deposition (ALD) has been identified as a promising growth method for high-uniformity superconducting thin films for superconducting quantum photonic applications, offering superior uniformity, thickness control and conformality to techniques such as reactive sputtering. The potential scalability of ALD makes this method especially appealing for fabrication of superconducting nanowires and resonators across large areas. We report on the growth of highly uniform superconducting NbN thin films via plasma-enhanced atomic layer deposition (PEALD) with radio frequency substrate biasing, on a 200 mm (8 inch) Si wafer, specifically for superconducting nanowire single-photon detector applications. Niobium nitride films were grown using (tert-butylimido)-tris(diethylamido)-niobium(V) precursor and an H-2/Ar plasma. The superconducting properties of a variable thickness series of films (5.9-29.8 nm) show critical temperature (T-c) of 13.5 K approaching bulk thickness (28.8 nm) with low suppression down to the ultrathin regime (5.9 nm), with T-c = 10.2 K. T-c across the 200 mm wafer with 8 nm thick NbN, measured in 15 mm intervals, exhibits minimal variation (<7%). Microbridge structures fabricated on 8 nm thick NbN films also exhibit high critical current densities (J( c)), > 10 MA cm(-2) at 2.6 K. PEALD could therefore be a pivotal technique in enabling large-scale fabrication of integrated quantum photonic devices across a variety of applications.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据