Chemical etching enhanced nanosecond pulsed laser micromachining: An experimental and numerical investigation

Nanosecond pulsed laser micromachining (PLM) under liquid confinement is a highly precise, flexible, efficient, and non-contact manufacturing process being used in widespread applications. The process efficiency of the PLM as determined by the laser ablation rate, however, often quickly reaches saturation with the increase of laser energy. This is ascribed to the screening effect of laser-induced plasma that absorbs part of incident energy. In this study, a chemical etching enhanced PLM (CE-PLM) is developed to tackle this challenge. By replacing water (H2O) with an environmentally friendly and active liquid confinement - hydrogen peroxide (H2O2), single-shot laser ablation experiments were firstly performed on different metallic materials to evaluate the considerably enhanced ablation rate. Then, the beneficial effects of H2O2 on PLM applications including micro-drilling and micro-grooving were investigated. The enhanced ablation rate and PLM efficiency were attributed to the synergistic effect of laser ablation and ultrafast chemical etching. Moreover, a physics-based model was developed to elucidate the process mechanism, with focus on revealing the contribution of chemical etching to the material removal during CE-PLM as affected by laser processing parameters. The findings of this study will contribute to enhancing the efficiency and capability of PLM techniques towards broader industrial applications.

Automated summary

A chemical etching enhanced PLM (CE-PLM) technique was developed in this study, utilizing hydrogen peroxide (H2O2) as the liquid confinement to enhance the laser ablation rate and efficiency through the synergistic effect of laser ablation and ultrafast chemical etching. The findings contribute to enhancing the efficiency and capability of PLM techniques for broader industrial applications.