4.7 Article

Surface and subsurface damage of laser assisted grinding CrCoNi medium-entropy alloy at atomic/nano scale

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TRIBOLOGY INTERNATIONAL
卷 191, 期 -, 页码 -

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ELSEVIER SCI LTD
DOI: 10.1016/j.triboint.2023.109121

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Medium -entropy alloy; Laser assisted grinding; Material removal; Surface and subsurface damage

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In this paper, the surface and subsurface damage of laser assisted grinding CrCoNi medium entropy alloys were investigated using molecular dynamics simulations. The results showed that the application of laser energy can reduce cutting forces and minimize subsurface damage.
CrCoNi medium entropy alloys (MEAs) are widely used in different fields due to their excellent mechanical properties. When superimposed on laser, machining mechanism can become different. In this paper, the surface and subsurface damage (SSD) of laser assisted grinding (LAG) CrCoNi MEA are investigated utilizing molecular dynamics (MD) simulations. Material removals including cutting force and removal atoms are charactered. Furthermore, the subsurface evolutions e. g. shear strain distribution and dislocation mechanism are analyzed. The results implied that the application of laser energy can decrease cutting forces by 17.22-35.63%. It can also be concluded that with the assistance of proper laser power, the SSDs are reduced. Those simulation results can provide guidance for optimizing the process parameters of LAG.

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