Research Progress on the Solder Joint Reliability of Electronics Using in Deep Space Exploration

The spacecraft for deep space exploration missions will face extreme environments, including cryogenic temperature, intense radiation, wide-range temperature variations and even the combination of conditions mentioned above. Harsh environments will lead to solder joints degradation or even failure, resulting in damage to onboard electronics. The research activities on high reliability solder joints using in extreme environments can not only reduce the use of onboard protection devices, but effectively improve the overall reliability of spacecraft, which is of great significance to the aviation industry. In this paper, we review the reliability research on SnPb solder alloys, Sn-based lead-free solder alloys and In-based solder alloys in extreme environments, and try to provide some suggestions for the follow-up studies, which focus on solder joint reliability under extreme environments.

Automated summary

The spacecraft for deep space exploration missions will encounter extreme environments, including cryogenic temperature, intense radiation, wide-range temperature variations, and even a combination of these conditions. The degradation or failure of solder joints in harsh environments can result in damage to onboard electronics. The research on high reliability solder joints in extreme environments can reduce the need for onboard protection devices and improve the overall reliability of spacecraft, which is of great significance to the aviation industry. This paper reviews the reliability research on SnPb solder alloys, Sn-based lead-free solder alloys, and In-based solder alloys in extreme environments, and provides suggestions for future studies focusing on solder joint reliability under extreme environments.