A Novel MCT Focal Plane Array Thermally Stressed at Low Temperatures

The mercury-cadmium-telluride (MCT) focal plane arrays (FPAs) have being populating most of the ground and space instrumentation devoted to near-and short-wave infrared (NIR-SWIR) during the past decades. The Astronomy European Infrared Detector (ASTEROID) project is a fully European initiative to achieve a local manufacturer ready to develop MCT FPAs of =2k(2) class. To test and characterize such detectors, special facilities are demanded. In this way, the Institut de Fisica d'Altes Energies (IFAE) has conducted a research to validate the hybridization reliability of the readout integrated circuit (ROIC) and the MCT detector, which is performed through indium bumps' soldering technique. The hybridization reliability was measured by subjecting the ASTEROID detector to several thermal cycles in a temperature range that surpasses the detector operating temperature. At every individual thermal cycle, a set of images were captured, analyzed, and compared with each other to track any pixel degradation. Finally, making use of image classification and segmentation algorithms, the measured number of damaged pixels was determined and the results are presented in this article.

Automated summary

The ASTEROID project aims to develop MCT FPAs of =2k(2) class. A research conducted by the IFAE validated the reliability of hybridization between the ROIC and MCT detector using indium bumps' soldering technique. The number of damaged pixels was measured through thermal cycling and image analysis.