Structural Effects of Crumpled Graphene and Recent Developments in Comprehensive Sensor Applications: A Review

Graphene is a 2D honeycomb lattice consisting of a single layer of carbon atoms. Graphene has become one of the most preferred materials for sensor development due to its exceptional electrical, mechanical, and thermal characteristics. Nonetheless, little consideration is given to the production and use of crumpled graphene. Specifically, the crumpled graphene structure is a good choice for enhancing sensors' sensitivity and structural deformability by reducing interfacial stress, avoiding electrical failure, and enhancing surface areas. This review article provides an overview of various synthesis processes using crumpled graphene and specifies a brief idea to control crumpled formation in graphene structure for sensing applications in recent years. Furthermore, it summarizes the problems encountered in previously published research articles during the fabrication and performance of sensors with a brief discussion of fundamental mechanics and topological aspects concerning crumpling patterns with sensing performance. It also highlights the current status of crumpling techniques and their effects on developing different sensors using existing crumpling methods, controlled crumpling designs, and sensing methodologies for future applications.

Automated summary

Graphene is a 2D honeycomb lattice made of a single layer of carbon atoms, and it has exceptional electrical, mechanical, and thermal characteristics, making it a preferred material for sensor development. However, little attention has been given to crumpled graphene. Crumpled graphene structures can enhance sensor sensitivity and deformability by reducing stress, preventing electrical failure, and increasing surface areas. This review article provides an overview of synthesis processes using crumpled graphene and discusses the control of crumpling for sensing applications. It also highlights the problems encountered in previous research and the current status of crumpling techniques for future sensor development.