期刊
SCIENTIFIC REPORTS
卷 6, 期 -, 页码 -出版社
NATURE PUBLISHING GROUP
DOI: 10.1038/srep24418
关键词
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资金
- National Natural Science Foundation of China [51302207]
- Fundamental Research Funds for the Central Universities [2015gjhz03]
- National Young 1000 Talents Program of China
- Office of Science, Office of Basic Energy Sciences, Materials Science Division, of the U.S. Department of Energy [DE-AC02-05CH11231]
- International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies
- Collaborative Innovation Center of High-End Manufacturing Equipment
Here we report an in situ study of the early stage of microstructure evolution induced by electromigration in a Pb-free beta-Sn based solder joint by synchrotron polychromatic X-ray microdiffraction. With this technique, crystal orientation evolution is monitored at intragranular levels with high spatial and angular resolution. During the entire experiment, no crystal growth is detected, and rigid grain rotation is observed only in the two grains within the current crowding region, where high density and divergence of electric current occur. Theoretical calculation indicates that the trend of electrical resistance drop still holds under the present conditions in the grain with high electrical resistivity, while the other grain with low resistivity reorients to align its a-axis more parallel with the ones of its neighboring grains. A detailed study of dislocation densities and subgrain boundaries suggests that grain rotation in beta-Sn, unlike grain rotation in high melting temperature metals which undergo displacive deformation, is accomplished via diffusional process mainly, due to the high homologous temperature.
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