Direct adhesion between Cu foil and polytetrafluoroethylene without increasing surface roughness for high-frequency printed wiring boards

Polytetrafluoroethylene (PTFE) serves as a suitable dielectric substrate for high-frequency printed wiring boards (PWBs) owing to its excellent properties at high frequency. However, to the best of our knowledge, no study has investigated the strong adhesion between PTFE and Cu foil with low surface roughness. Therefore, in this study, pure-PTFE comprising a weak boundary layer (WBL) on the surface and glass-cloth-containing PTFE (GC-PTFE), which did not contain a WBL, were subjected to heat-assisted plasma (HAP) treatment. Thereafter, we investigated the surface chemical bonding state, surface morphology, and adhesion properties of the as-prepared PTFE toward Cu foil with low surface roughness. As observed, oxygen-containing functional groups were generated on the HAP-treated PTFE, and the WBL in the as-received pure-PTFE was eliminated via HAP treatment. Moreover, the surface roughness of the HAP-treated PTFE did not increase compared to that of as-received PTFE. After performing thermal compression under atmospheric conditions, the adhesion strength of both HAP-treated pure-PTFE and GC-PTFE was & SIM;0.9 N mm-1. In addition, the adhesion strength of Cu/pure-PTFE and Cu/GC-PTFE increased after thermal compression under a reduced pressure, and the adhesion strength of 1 N mm-1 was obtained. Although the Cu foil was not roughened, Cu/PTFE realized strong adhesive strength. The developed method is advantageous because maintaining a low interface roughness is crucial for applying PTFE to manufacture high-frequency PWBs. The strong adhesion between Cu foil and polytetrafluoroethylene was obtained by heat-assisted plasma treatment and thermal compression under the reduced pressure.

Automated summary

In this study, a strong adhesion between polytetrafluoroethylene (PTFE) and copper foil was achieved using heat-assisted plasma (HAP) treatment and thermal compression under reduced pressure. This method is advantageous for maintaining a low interface roughness, making it suitable for manufacturing high-frequency printed wiring boards (PWBs). Evaluation: 9 out of 10.