相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。Intermixing reactions in electrodeposited Cu/Sn and Cu/Ni/Sn multilayer interconnects during room temperature and high temperature aging
Pay Ying Chia et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2015)
In-situ alloying of Sn-3.5Ag solder during reflow through Zn nanoparticle addition and its effects on interfacial intermetallic layers
A. S. M. A. Haseeb et al.
INTERMETALLICS (2014)
Effects of hydroquinone and gelatin on the electrodeposition of Sn-Bi low temperature Pb-free solder
Yingxin Goh et al.
ELECTROCHIMICA ACTA (2013)
Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn-3.8Ag-0.7Cu lead-free solder and copper substrate
S. L. Tay et al.
INTERMETALLICS (2013)
Creep and Mechanical Properties of Cu6Sn5 and (Cu,Ni)6Sn5 at Elevated Temperatures
Dekui Mu et al.
JOURNAL OF ELECTRONIC MATERIALS (2013)
Effect of Ni on phase stability and thermal expansion of Cu6-xNixSn5 (X=0, 0.5, 1, 1.5 and 2)
K. Nogita et al.
INTERMETALLICS (2012)
Abnormal Cu3Sn Growth and Kirkendall Formation Between Sn and (111) and (220) Preferred-Orientation Cu Substrates
T. S. Huang et al.
ELECTROCHEMICAL AND SOLID STATE LETTERS (2011)
Stress Relaxation Mechanisms of Sn and SnPb Coatings Electrodeposited on Cu: Avoidance of Whiskering
M. Sobiech et al.
JOURNAL OF ELECTRONIC MATERIALS (2011)
Phase formation at the Sn/Cu interface during room temperature aging: Microstructural evolution, whiskering, and interface thermodynamics
Matthias Sobiech et al.
JOURNAL OF MATERIALS RESEARCH (2011)
Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys
Kazuhiro Nogita
INTERMETALLICS (2010)
An ordered structure of Cu3Sn in Cu-Sn alloy investigated by transmission electron microscopy
Mahan Sang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2009)
Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth
Y. W. Wang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2009)
Nanoindentation characterization of intermetallic compounds formed between Sn-Cu(-Ni) ball grid arrays and Cu substrates
Hideaki Tsukamoto et al.
MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS (2009)
Formation of intermetallic compounds between liquid Sn and various CuNix metallizations
V. Vuorinen et al.
JOURNAL OF ELECTRONIC MATERIALS (2008)
Nickel-stabilized hexagonal (Cu, Ni)6Sn5 in Sn-Cu-Ni lead-free solder alloys
Kazuhiro Nogita et al.
SCRIPTA MATERIALIA (2008)
First-principles investigation of the structural and electronic properties of Cu6-xNixSn5 (x=0, 1, 2) intermetallic compounds
Chun Yu et al.
INTERMETALLICS (2007)
Solder/substrate interfacial reactions in the Sn-Cu-Ni interconnection system
H. Yu et al.
JOURNAL OF ELECTRONIC MATERIALS (2007)
Investigation of interdiffusion in copper-nickel bilayer thin films
Ahmed M. Abdul-Lettif
PHYSICA B-CONDENSED MATTER (2007)
Nano-indentation characterization of Ni-Cu-SnIMC layer subject to isothermal aging
LH Xu et al.
THIN SOLID FILMS (2006)
Effects of Co and Ni addition on reactive diffusion between Sn-3.5Ag solder and Cu during soldering and annealing
F Gao et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2006)
The nanoindentation characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds in the solder bump
GY Jang et al.
JOURNAL OF ELECTRONIC MATERIALS (2004)
Interfacial reactions in the Sn-(Cu)/Ni, Sn-(Ni)/Cu, and Sn/(Cu,Ni) systems
SW Chen et al.
JOURNAL OF ELECTRONIC MATERIALS (2003)
Phase equilibria and solidification properties of Sn-Cu-Ni alloys
CR Lin et al.
JOURNAL OF ELECTRONIC MATERIALS (2002)
Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles
F Guo et al.
JOURNAL OF ELECTRONIC MATERIALS (2001)
分享论文
