期刊
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
卷 6, 期 7, 页码 1058-1067出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TCPMT.2016.2576998
关键词
Evaporative cooling; high fluxes; thin nanoporous membrane
类别
资金
- Defense Advanced Research Projects Agency within ICECool Fundamentals Program
We present a high-heat-flux cooling device for advanced thermal management of electronics. The device incorporates nanoporous membranes supported on microchannels to enable thin-film evaporation. The underlying concept takes advantage of the capillary pressure generated by small pores in the membrane, and minimizes the viscous loss by reducing the membrane thickness. The heat transfer and fluid flow in the device were modeled to determine the effect of different geometric parameters. With the optimization of various parameters, the device can achieve a heat transfer coefficient in excess of 0.05 kW/cm(2)-K, while dissipating a heat flux of 1 kW/cm(2). When applied to power electronics, such as GaN high-electron-mobility transistors, this membrane-based evaporative cooling device can lower the near-junction temperature by more than 40 K compared with contemporary single-phase microchannel coolers.
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