期刊
THIN SOLID FILMS
卷 612, 期 -, 页码 153-164出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.tsf.2016.05.044
关键词
Copper metallization; Thermo-mechanical fatigue; Twin boundary migration; Void formation; Surface roughening; Small angle grain boundary formation; Inorganic impurities
类别
资金
- ENIAC Joint Undertaking (ENIAC JU Grant) [325608]
- programme Forschung, Innovation und Technologie fur Informationstechnologie by the Austrian Ministry for Transport, Innovation and Technology [838774]
In this study, two different electrodeposited 5 mu m thick copper films were subjected to thermal cycling. The microstructural evolution of both films was studied with a site specific tracking technique. It was observed that the initially similar microstructures develop differently upon cycling with respect to grain size and texture. In detail, a Cu film which contains residual inorganic species from the organic additives used during Cu plating, in the ppm regime, showed a constrained surface roughness evolution and marginal grain growth coupled with a stable twin boundary network. Furthermore, voiding in the film interior was observed. In comparison, a high-purity Cu film exhibited strong surface roughening in conjunction with pronounced grain growth promoted by twin boundary migration. Moreover, the film showed a (100) texture intensity increase as a result of strain energy minimization upon cycling and no void formation. These observations underline the influence of film processing related impurities on the thermo-mechanical behaviour of Cu thin films. (C) 2016 Elsevier B.V. All rights reserved.
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