期刊
SURFACE SCIENCE
卷 652, 期 -, 页码 355-366出版社
ELSEVIER SCIENCE BV
DOI: 10.1016/j.susc.2016.01.010
关键词
Whiskers; Tin; Growth; Sputtering; AES
We report several methods to reliably grow dense fields of high-aspect ratio tin whiskers for research a period of days to weeks. The techniques offer marked improvements over previous means to grow which have struggled against the highly variable incubation period of tin whiskers and slow growth rate. of the film stress is the key to fast-growing whiskers, owing to the fact that whisker incubation and fundamentally a stress-relief phenomenon. The ability to grow high-density fields of whiskers in a reasonable period of time (days, weeks) has accelerated progress in whisker growth and development of whisker mitigation strategies. (C) 2016 Elsevier B.V. All rights
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据