Deterministic Integration of Out-of-Plane Sensor Arrays for Flexible Electronic Applications

SMALL

卷 12, 期 37, 页码 5141-5145

WILEY-V C H VERLAG GMBH

3D integration; flexible electronics; sensors; through polymer vias

Chemistry, Multidisciplinary Chemistry, Physical Nanoscience & Nanotechnology Materials Science, Multidisciplinary Physics, Applied Physics, Condensed Matter

1. King Abdullah University of Science and Technology (KAUST) Baseline Research Fund [BAS/1/1619-01-01]