期刊
CIRP ANNALS-MANUFACTURING TECHNOLOGY
卷 64, 期 1, 页码 349-352出版社
ELSEVIER SCIENCE BV
DOI: 10.1016/j.cirp.2015.04.005
关键词
Surface integrity; Grinding; Silicon
资金
- Excellent Young Scientists Fund of NSFC [51422502]
- Science Fund for Creative Research Groups of NSFC [51321004]
- Program for New Century Excellent Talents in University [NCET-13-0086]
- Science Fund of the State Key Laboratory of Mechanical Transmissions [SKLMT-KFKT-201405]
- Chongqing University
- Fundamental Research Funds for the Central Universities [DUT14YQ215]
- Integrated Program of Major Research Plan of NSFC [91323302]
This study investigates diamond scratching at a high speed comparable to that in a grinding process on an ultraprecision grinder. Diamond tips are prepared for the study. The scratched silicon wafer is observed for changes in the surface layer with transmission electron microscopy. The observation discovers that an amorphous layer is formed on top of the pristine Si-I phase before the onset of chip formation. This discovery is different from the previous findings in which a damaged silicon layer is identified underneath the amorphous layer. Furthermore, no high pressure phase is found before the onset of chip formation. (C) 2015. CIRP.
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