All-solution-processed PIN architecture for ultra-sensitive and ultra-flexible organic thin film photodetectors

An ideal organic thin film photodetectors (OTFPs) should adopt a hierarchical, multilayer p-type/blend-type/n-type (PIN) structure, with each layer having a specific purpose which could greatly improve the exciton dissociation while guarantee efficient charge transport. However, for the traditional layer-by-layer solution fabrication procedure, the solvent used can induce organic material mixing and molecular disordering between each layer. Hence, such architecture for OTFPs can now only be formed via thermal evaporation. In this paper, a contact-film-transfer method is demonstrated to all-solution processing organic PIN OTFPs on flexible substrates. The fabricated PIN OTFPs exhibit high photoresponse and high stability under continuous mechanical bending. Hence, the method we described here should represent an important step in the development of OTFPs in the future.