Conductivity and mechanical properties of conductive adhesive with silver nanowires

The aim of this study was to develop conductive adhesive using silver nanowires prepared via solvothermal method as conductive fillers and epoxy-modified organosilicone resin as matrix resin. Effect of the addition of silver nanowires/flakes on the conductive adhesive's electrical and mechanical properties was investigated. Compared with conventional conductive adhesive with silver flakes fillers, the percolation threshold of conductive adhesive with silver nanowires fillers is 10 % lower approximately. However, further rise of the content of silver nanowires has no obvious influence on improvement of the electrical conductivity of conductive adhesive. Both conductive and mechanical properties of conductive adhesive can be compatible by adding silver nanowires, which traditional silver conductive adhesives cannot reach. Silver nanowires with a pleasurable morphology prepared via alcohothermal method were introduced into the conductive adhesive compositions. It can be found find that silver nanowires are overlapped fairly in the conductive adhesive, though existing crosslinking to some extent, yet silver nanowires do not appear the phenomenon of agglomeration. The conductive adhesive with silver nanowires as conductive fillers can exhibit favorable electrical and mechanical properties.