A novel way to reduce the critical deformation for cold roll bonding

In the present study, a novel approach is presented to achieve oxygen partial pressures corresponding to extremely high vacuum (XHV) to foster cold roll bonding. Cold roll bonding of Al/Al and Cu/Cu as well as the heterogeneous combination Al/Cu were investigated with a focus on the minimum degree of defor-mation required to form a solid bond. By applying XHV-adequate conditions, the minimum degree of deformation for the formation of a solid bond could be reduced by up to 35%. Furthermore, it was evident that the adhesion behaviour changed during bond formation in XHV-adequate conditions.(c) 2023 Society of Manufacturing Engineers (SME). Published by Elsevier Ltd. All rights reserved.

Automated summary

A novel approach is presented to achieve oxygen partial pressures corresponding to extremely high vacuum (XHV) for cold roll bonding. The minimum degree of deformation required to form a solid bond was reduced by up to 35% using XHV-adequate conditions. Adhesion behavior changed during bond formation in XHV-adequate conditions.