☆
4.7
Review
Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T (2023)
评价这篇论文
主要评分表示论文的整体质量水平。次要评分独立反映论文的优点或缺点。
Discover Peeref hubs
Discuss science. Find collaborators. Network.
Join a conversationBecome a Peeref-certified reviewer
The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.
Get Started