Effect of Mo content on interfacial microstructure and properties of explosive welded Mo-Cu/Cu plates

In this study, Mo-Cu/Cu plates were successfully fabricated by explosive welding and the influence of Mo content on their interfacial microstructure, shear strength, thermal conductivity and electrical conductivity was investigated. The results showed that as the Mo content increased to 70 wt%, the number of serrations at the interface of the Mo70Cu30/Cu plate increased, exhibiting a more complete shape and periodically ordered arrangement. In addition, increasing the Mo content to 70 wt% leads to a significant improvement in the interdiffusion distance at the interface, resulting in significant improvements in shear strength, thermal conductivity and electrical conductivity compared to the corresponding Mo70Cu30 plate. More serrations, more complete serrations and periodically arranged serrations benefit from increased Mo content to 70 wt% while improving the shear strength, thermal conductivity and electrical conductivity compared to raw material of Mo-Cu plate.

Automated summary

Mo-Cu/Cu plates were fabricated by explosive welding, and the influence of Mo content on their interfacial microstructure and properties was investigated. Increasing the Mo content to 70 wt% resulted in improved performance.