期刊
PHYSICAL REVIEW APPLIED
卷 19, 期 6, 页码 -出版社
AMER PHYSICAL SOC
DOI: 10.1103/PhysRevApplied.19.064076
关键词
-
By harnessing the properties of phonons on a chip, researchers have developed a new type of overlay slot phononic waveguide that can overcome the limitations of current waveguides. By patterning a thin silicon cladding layer on an unetched gallium-nitride-on-sapphire substrate, this new waveguide enables integration with electronic and photonic elements on the same chip. Experimental results show the guiding and power splitting capabilities of gigahertz surface acoustic waves in these waveguides, with low propagation loss. Theoretical predictions suggest that a phononic bound state in the continuum can be achieved under special conditions.
Harnessing the properties of phonons on a chip, phononic integrated circuits are playing an increasingly important role in optoelectronic integration. To date, most of such phononic waveguides are realized by etching a piezoelectric layer and forming a wire, which not only involves complicated fabrication processes but also limits integration with electronic and photonic elements on the same chip. To overcome these difficulties, here we propose and demonstrate a type of overlay slot phononic waveguide obtained by patterning a thin silicon cladding layer on an unetched gallium-nitride-on-sapphire substrate. We experimentally demonstrate the guiding and power splitting of gigahertz surface acoustic waves in such waveguides, with a measured propagation loss of about 1.80 dB/mm for the Rayleigh mode. We also theoretically predict that the Love mode in such waveguides can turn into a phononic bound state in the continuum under special conditions. Such waveguides introduce an alternative paradigm for phononic integrated circuitry and will enable applications in information processing, environmental monitoring, and noninvasive manipulation of biomolecules on a chip.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据