Preparation of Dispersed Copper(II) Oxide Nanosuspensions as Precursor for Femtosecond Reductive Laser Sintering by High-Energy Ball Milling

This contribution demonstrates and discusses the preparation of finely dispersed copper(II) oxide nanosuspensions as precursors for reductive laser sintering (RLS). Since the presence of agglomerates interferes with the various RLS sub-processes, fine dispersion is required, and oversized particles must be identified by a measurement methodology. Aside from the established method of scanning electron microscopy for imaging individual dried particles, this work applies the holistic and statistically more significant laser diffraction in combination with dynamic image analysis in wet dispersion. In addition to direct ultrasonic homogenization, high-energy ball milling is introduced for RLS, to produce stable nanosuspensions with a high fine fraction, and, above all, the absence of oversize particles. Whereas ultrasonic dispersion stagnates at particle sizes between 500 nm and 20 mu m, even after 8 h, milled suspension contains a high proportion of finest particles with diameters below 100 nm, no agglomerates larger than 1 mu m and a trimodal particle size distribution with the median at 50 nm already, after 100 min of milling. The precursor layers produced by doctor blade coating are examined for their quality by laser scanning microscopy. The surface roughness of such a dry film can be reduced from 1.26 mu m to 88 nm by milling. Finally, the novel precursor is used for femtosecond RLS, to produce homogeneous, high-quality copper layers with a sheet resistance of 0.28 omega/sq and a copper mass concentration of 94.2%.

Automated summary

This study demonstrates the preparation of finely dispersed copper(II) oxide nanosuspensions as precursors for reductive laser sintering (RLS) and discusses different methods for particle dispersion. Nanosuspensions prepared by high-energy ball milling exhibit a higher proportion of fine particles and a more uniform particle size distribution, which can be used to produce high-quality copper layers.