4.7 Article

Enhanced Thermal and Dielectric Properties of Polyarylene Ether Nitrile Nanocomposites Incorporated with BN/TiO2-Based Hybrids for Flexible Dielectrics

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POLYMERS
卷 15, 期 21, 页码 -

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MDPI
DOI: 10.3390/polym15214279

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polyarylene ether nitrile; nanohybrid; nanocomposites; thermal stability

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This study proposes a method for preparing highly thermal-resistant dielectric nanocomposites by decorating TiO2 nanoparticles on the surface of BN nanosheets and combining them with a PEN matrix. The experimental results show that this nanocomposite material has significantly improved glass transition temperature and dielectric properties, as well as good thermal stability.
Outstanding high-temperature resistance, thermal stability, and dielectric properties are fundamental for dielectric materials used in harsh environments. Herein, TiO2 nanoparticles are decorated on the surface of BN nanosheets by internal crosslinking between polydopamine (PDA) and polyethyleneimine (PEI), forming three-dimensional novel nanohybrids with a rough surface. Then, an ether nitrile (PEN) matrix is introduced into the polyarylene to form polymer-based nanocomposite dielectric films. Meanwhile, the structure and micromorphology of the newly prepared nanohybrids, as well as the dielectric and thermal properties of PEN nanocomposites, are investigated in detail. The results indicate that TiO2 nanoparticles tightly attach to the surface of BN, creating a new nanohybrid that significantly enhances the comprehensive performance of PEN nanocomposites. Specifically, compared to pure PEN, the nanocomposite film with a nanofiller content of 40 wt% exhibited an 8 degrees C improvement in the glass transition temperature (T-g) and a 162% enhancement in the dielectric constant at 1 kHz. Moreover, the dielectric constant-temperature coefficient of the nanocomposite films remained below 5.1 x 10(-4) degrees C-1 within the temperature range of 25-160 degrees C, demonstrating excellent thermal resistance. This work offers a method for preparing highly thermal-resistant dielectric nanocomposites suitable for application in elevated temperature environments.

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