Fabricating Inner Channels in Laser Additive Manufacturing Process via Thin-Plate-Preplacing Method

This paper presents a hybrid manufacturing process for the preparation of complex cavity structure parts with high surface quality. Firstly, laser precision packaging technology is utilized to accurately connect a thin plate to a substrate with microchannel. Secondly, Direct Metal Laser-Sintering (DMLS) technology is utilized to completely shape the part. The morphology and microstructure of laser encapsulated specimens and DMLS molded parts were investigated. The results show that the thin plate and the substrate can form a good metallurgical bond. The lowest surface roughness of the DMLS molded parts was 1.18 mu m. The perpendicularity between the top of the microchannel and the side wall was optimal when the laser power was 240 W. Consequently, the hybrid manufacturing process effectively solves the problems of poor surface quality and powder sticking of closed inner cavities. The method effectively eliminates the defects of adhesive powder in the inner cavity of the DMLS microchannel, improves the finish, and solves the problem that mechanical tools cannot be processed inside the microchannel, which lays the foundation for the research of DMLS high-quality microchannel process.

Automated summary

This paper presents a hybrid manufacturing process using laser precision packaging technology and Direct Metal Laser-Sintering (DMLS) technology to prepare complex cavity structure parts with high surface quality. The results show that this process effectively solves the problems of poor surface quality and powder sticking in closed inner cavities.