Negative-Tone Photosensitive Polymeric Bonding Material to Enable Room Temperature Prebond for Cu/Polymer Hybrid Bonding

Proceedings Paper Engineering, Electrical & Electronic

Numerical Simulation of Cu/Polymer-Dielectric Hybrid Bonding Process using Finite Element Analysis

Sasi Kumar Tippabhotla et al.

Summary: A numerical simulation model is developed to study chip to wafer hybrid bonding process with polymer dielectrics using finite element analysis. Virtual design of experiments is conducted to evaluate the bonding area and peel stresses in different scenarios. The results suggest that direct bonding of Cu/polymer interfaces can be achieved with the right combination of Cu pad protrusion and other design and process parameters, but the direct bonding window is narrow for the Cu pad dishing case.

IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022) (2022)

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Proceedings Paper Engineering, Manufacturing

The unique properties of SiCN as bonding material for hybrid bonding

Serena Iacovo et al.

Summary: The successful direct Cu-SiCN hybrid bonding was achieved by using a thermal budget of 250 degrees C, with tight control on processing steps and the properties of SiCN dielectric material playing a key role.

2021 7TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) (2021)

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Proceedings Paper Engineering, Manufacturing

Microstructure analysis and tensile strength of low temperature Cu bonds using highly-⟨111⟩ Cu

Jia-Juen Ong et al.

Summary: This investigation demonstrates that bonding strength can be improved by adjusting the microstructures in Cu joints, with nanotwinned Cu pads showing promising results. However, precautions should be taken to avoid excessive bonding time or pressure, as it may trigger recrystallization and grain growth. Adjusting bonding time or temperature can help control the microstructure in Cu pads, resulting in improved bonding strength.

2021 7TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) (2021)

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Proceedings Paper Engineering, Electrical & Electronic

Development of Hybrid Bonding Process for Embedded Bump with Cu-Sn/BCB Structure

Huang Chen et al.

Summary: This study investigated a hybrid bonding scheme with asymmetric embedded Cu-Sn/Cu bump structure, using Photosensitive BCB as passivation material to achieve precise alignment and bonding effect. Efforts to achieve a void-free hybrid bonding interface were focused on surface pre-treatment and matching coefficients of thermal expansion, providing strong technical support for future 3D integration.

IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021) (2021)

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Proceedings Paper Engineering, Electrical & Electronic

Asymmetric Low Temperature Cu-Polymer Hybrid Bonding with Au Passivation Layer

Ming-Wei Weng et al.

Summary: An asymmetric Cu-polymer hybrid bonding technology was developed for bonding at 200 degrees C, achieving optimal quality bonding. A chip-level hybrid bonding structure was fabricated successfully with both metal and polymer regions well bonded. The bonded structure maintained excellent electrical properties even after electrical measurements and stress tests. This research provides a practical concept for low temperature hybrid bonding in 3D integration.

2021 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATIONS (VLSI-TSA) (2021)

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Article Engineering, Electrical & Electronic