Rapid realization of ultra-high vacuum packaging of atomic chips by thick film technology

Article Materials Science, Multidisciplinary

A history of vacuum technology from 5th Century BC and a personal view of progress in the field, including medical applications, from 1959 to 2021

John S. Colligon

Summary: This article examines the evolution of vacuum from ancient times to its significance in modern science, specifically in industrial and medical applications. The author shares personal experiences in vacuum research and community engagement, highlighting the major accomplishments of his team and colleagues.

VACUUM (2022)

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Article Engineering, Chemical

A novel combined anodic-adhesive bonding technique for joining glass to metal for micro device applications

Roohollah Nazari et al.

Summary: A novel bonding technique consisting of anodic and adhesive bonding methods was proposed for joining glass to metal. The effect of metallization and different surface treatments on the bonding surface characteristics and joint strength was examined. Metallization and abrading glass surfaces both improved the bonding surface wettability and joint strength, with a synergistic effect observed when both methods were applied simultaneously. The failure mode of the joints was significantly influenced by the surface metallization and treatment methods.

INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES (2022)

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Article Engineering, Electrical & Electronic

The MEMS-Based Electrochemical Seismic Sensor With Integrated Sensitive Electrodes by Adopting Anodic Bonding Technology

Chao Xu et al.

Summary: A method was developed to fabricate MEMS-based integrated electrodes for electrochemical seismic sensors, which employed a three-layer anodic bonding structure of silicon-glass-silicon. The proposed integrated electrodes demonstrated high sensitivity and integration, with a cross-correlation coefficient of 0.998 and sensitivity of 5956 V/(m/s) @1Hz. This electrode represents a sensitive structure with both high sensitivity and high integration in electrochemical seismic sensors.

IEEE SENSORS JOURNAL (2021)

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Article Nanoscience & Nanotechnology