Electrochemical polishing of chemical vapor deposited niobium thin films

Combining chemical vapor deposition (CVD) with electrochemical polish (EP) operation is a promising route to producing performance-capable superconducting films for use in the fabrication of cost-effective components for superconducting radiofrequency (SRF) particle accelerators and superconducting quantum computers. The post-deposition EP process enables a critically necessary reduction in surface roughness of niobium (Nb) thin films to promote optimal superconducting surface conditions. This work investigated surface morphology, roughness, and crystal orientation of the CVD-grown and EP-polished Nb films. The CVD films were found to comprise steps and pyramidal features, resulting in undesirable large peak-to-valley distances. EP was demonstrated to significantly diminish the height of pyramids and effectively minimize the overall surface roughness. EP results showed a probable dependence on the crystal orientation. These understandings identify the EP principles tied to CVD-grown Nb films that allow further refinement of surface profiles for film-based SRF applications.

Automated summary

Combining chemical vapor deposition (CVD) with electrochemical polish (EP) operation is a promising method for producing performance-capable superconducting films. This study investigated the surface characteristics of CVD-grown and EP-polished niobium (Nb) films and found that EP effectively reduces surface roughness. The results suggest a dependence of EP on crystal orientation, providing insights for further optimization of film-based applications.