4.5 Article

Effect of aged material properties on transverse crack performance with two-round field observations

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TAYLOR & FRANCIS LTD
DOI: 10.1080/14680629.2023.2230323

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Thermal cracking; aging effect; material property; pavement structure; climatic condition

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This paper aims to validate the relationship between thermal-related parameters and field-measured thermal cracking. Field thermal cracking data from four projects with twelve pavement sections are collected. Material properties including creep compliance m-value, tensile strength of mixture, and asphalt low-temperature performance grade (PG) are considered. A lower m-value and tensile strength result in higher thermal cracking, while a lower low-temperature PG shows a contrary trend. One or several material properties cannot fully characterize field thermal cracking for all projects. Three-dimensional finite element models (FEM) consider the changes in material properties, pavement structures, and climatic conditions. The aging effect of material properties contributes to an increase in thermal stress. The placement of chip seal can greatly reduce the aging rate, and thicker pavement leads to less thermal stress. Both material property and thickness are important design factors for thermal cracking resistance.
This paper is aimed to validate the trend between thermal-related parameters and field-measured thermal cracking. Field thermal cracking is collected from four projects with twelve pavement sections. The material properties include creep compliance m-value and tensile strength of mixture, and asphalt low-temperature performance grade (PG). A lower value of m-value and tensile strength leads to a higher thermal cracking, while the low-temperature PG has the contrary trend. One or even several material properties cannot fully characterize field thermal cracking for all projects. Then the change of material properties, pavement structures, and climatic conditions are considered in three-dimensional finite element models (FEM). The aging effect of material properties attributes to the increase of thermal stress. The placement of chip seal could greatly reduce the aging rate, and the thicker pavement result in less thermal stress. Both material property and thickness are important design factors for thermal cracking resistance.

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