期刊
POLYMER
卷 283, 期 -, 页码 -出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.polymer.2023.126217
关键词
Bisphenol A; Bisphenol F; Epoxy resin; Aggregate structure; Fluorescence
This study investigates the fluorescence spectra of BPF epoxy resin and identifies two emission peaks, one from the BPF epoxy monomer and the other from an aggregate structure. The aggregate structure is determined to be an H-aggregate based on experimental and theoretical calculations. Thermal exposure causes changes in the aggregate structure, allowing the fluorescence signal to serve as an indicator of polymer network rearrangement.
Bisphenol F (BPF) epoxy resin is a prepolymer component of thermosets used in construction of reinforced carbon fiber composites (RCFC). The fluorescence of this resin can provide information about chemical and structural alterations of the thermoset from thermal or mechanical damage. While some work has investigated the fluorescence spectra of bisphenol A epoxy resin, a structural analog of BPF, none have studied BPF. The purpose of this study is to investigate the baseline fluorescence spectra of the BPF epoxy resin for features that could be utilized for monitoring damage and structural alterations. Bisphenol F epoxy resin was found to have two emission peaks with a broad peak centered at 410 nm and a sharp peak centered at 550 nm. The broad emission peak was identified as the fluorescence from BPF epoxy monomer while the sharp emission peak was found to be from an aggregate structure present in the epoxy resin. It is hypothesized that this structure is an H-aggregate based on the emission features and structural stability of the aggregate compared to the alternative J-aggregate which was determined via density functional theory calculations. The H-aggregate was found to persist into one of the cured thermoset formulations evaluated but was lost when exposed to elevated temperatures below thermal degradation of the thermoset. This loss of aggregate structure was due to polymer network rearrangement. This new fluorescence signature can be used as an indicator of polymer network rearrangement from thermal exposure which may alter the expected material performance and precede thermal degradation.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据