4.6 Article

Comprehensive investigation of sputtering deposition pressure effects on a-InGaZnO Schottky diodes

期刊

PHYSICA SCRIPTA
卷 98, 期 12, 页码 -

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IOP Publishing Ltd
DOI: 10.1088/1402-4896/ad052f

关键词

InGaZnO; IGZO; sputtering; deposition; characterization; Schottky; diode

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The effects of Ar sputtering deposition pressure on the optical, structural, morphological, and electrical properties of amorphous InGaZnO thin films were investigated. It was found that the increase in deposition pressure led to decreased surface roughness, decreased optical band gap, and changes in the properties of Schottky diodes based on InGaZnO thin films.
The effects of Ar sputtering deposition pressure on the optical, structural, morphological, and electrical properties of amorphous InGaZnO thin films were investigated. The InGaZnO thin films, which have amorphous structures determined by grazing incidence x-ray diffraction, contained In, Ga, Zn, and O confirmed by secondary ion mass spectrometry method. Additionally, when the thicknesses of the deposited thin films are examined, it was seen that the profilometer measurement results of the crater formed by secondary ion mass spectrometer and scanning electron microscope measurement results are nearly similar, and it is approximately 100 nm. The surface roughness, obtained from Atomic Force Microscopy results, show that decreased up to a particular value with the increase of the working pressure, and then the surface roughness increased. The optical band gaps of the films were obtained in the range of 3.50 eV-3.58 eV via Tauc relation by using the Ultraviolet-Visible measurements carried out in the wavelength range of 200 nm-1100 nm. It was seen that the optical band gap was decreased with the increase in Ar pressure. The electrical properties of InGaZnO thin film-based Schottky diodes, such as the barrier height, ideality factor, saturation current, series resistance, and shunt resistance, have also been studied comprehensively. The electrical results showed that diode properties change with increasing deposition pressure.

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