相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。A Hybrid Non-destructive Measuring Method of Three-dimensional Profile of Through Silicon Vias for Realization of Smart Devices
Heulbi Ahn et al.
SCIENTIFIC REPORTS (2018)
Focused ion beam-assisted fabrication of soft high-aspect ratio silicon nanowire atomic force microscopy probes
Peter Knittel et al.
ULTRAMICROSCOPY (2017)
Through silicon via profile metrology of Bosch etching process based on spectroscopic reflectometry
O. Fursenko et al.
MICROELECTRONIC ENGINEERING (2015)
An overview of through-silicon-via technology and manufacturing challenges
Jeffrey P. Gambino et al.
MICROELECTRONIC ENGINEERING (2015)
Metrology needs for through-silicon via fabrication
Victor Vartanian et al.
JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS (2014)
Spectral reflectometry for metrology of three-dimensional through-silicon vias
Yi-Sha Ku
JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS (2014)
Methods to Measure the Critical Dimension of the Bottoms of Through-Silicon Vias Using White-Light Scanning Interferometry
Changhong Hyun et al.
JOURNAL OF THE OPTICAL SOCIETY OF KOREA (2014)
3D Measurement of TSVs Using Low Numerical Aperture White-Light Scanning Interferometry
Taeyong Jo et al.
JOURNAL OF THE OPTICAL SOCIETY OF KOREA (2013)
Silicon nanowire atomic force microscopy probes for high aspect ratio geometries
Brian A. Bryce et al.
APPLIED PHYSICS LETTERS (2012)
Backside Infrared Interferometric Patterned Wafer Thickness Sensing for Through-Silicon-Via (TSV) Etch Metrology
Weng Hong Teh et al.
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING (2010)
Reflectometer-based metrology for high-aspect ratio via measurement
Yi-Sha Ku et al.
OPTICS EXPRESS (2010)