4.7 Article

High-temperature flexible metasurface with broadband microwave polarization rotation and low infrared emissivity

期刊

OPTICS AND LASER TECHNOLOGY
卷 165, 期 -, 页码 -

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ELSEVIER SCI LTD
DOI: 10.1016/j.optlastec.2023.109630

关键词

Metasurface; High temperature; Flexibility; Polarization rotation; Low infrared emissivity

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In this work, a high-temperature flexible metasurface framework is proposed that can simultaneously achieve microwave polarization rotation and low infrared emissivity. The framework is verified by fabricating and measuring a high-temperature resistant multi-spectrum compatible flexible metasurface, which can effectively work up to 300 degrees C. The metasurface achieves more than 90% orthogonal polarization rotation efficiency in the frequency range of 5.2-7.5 GHz for microwaves, and reduces the infrared emissivity to 0.22 in the wavelength range of 3-14 μm by designing the metasurface pattern with a metallic filling ratio of 84.42%.
Advanced electromagnetic functional materials are more and more inclined to integrated design, for instance the compatibility in different spectra as well as wide temperature ranges. Metasurface provides an effective solution for multi-spectrum compatible design owning to its extraordinary performance. In this work, we propose a hightemperature flexible metasurface framework, which can simultaneously realize microwave polarization rotation and low infrared emissivity. As verification, a high-temperature resistant multi-spectrum compatible flexible metasurface is fabricated and measured, which can availably work up to 300 degrees C. For microwaves, the metasurface achieves the orthogonal polarization rotation efficiency of more than 90% in 5.2-7.5 GHz. For infrared, the metallic filling ratio of 84.42% is constructed by designing the metasurface pattern, thus reducing the infrared emissivity to 0.22 in 3-14 mu m. This work provides a flexible metasurface framework for implementing multi-spectrum compatibility at high temperatures, which can be easily attached to the surface of hightemperature components and extended to more functional integration.

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