Growth kinetics and substrate stability during high-temperature molecular beam epitaxy of AlN nanowires

We study the molecular beam epitaxy of AlN nanowires between 950 degrees C and 1215 degrees C, well above the usual growth temperatures, to identify optimal growth conditions. The nanowires are grown by self-assembly on TiN(111) films sputtered onto Al2O3. Above 1100 degrees C, the TiN film is seen to undergo grain growth and its surface exhibits {111} facets where AlN nucleation preferentially occurs. Modeling of the nanowire elongation rate measured at different temperatures shows that the Al adatom diffusion length maximizes at 1150 degrees C, which appears to be the optimum growth temperature. However, analysis of the nanowire luminescence shows a steep increase in the deep-level signal already above 1050 degrees C, associated with O incorporation from the Al2O3 substrate. Comparison with AlN nanowires grown on Si, MgO and SiC substrates suggests that heavy doping of Si and O by interdiffusion from the TiN/substrate interface increases the nanowire internal quantum efficiency, presumably due to the formation of a SiN x or AlO x passivation shell. The outdiffusion of Si and O would also cause the formation of the inversion domains observed in the nanowires. It follows that for optoelectronic and piezoelectric applications, optimal AlN nanowire ensembles should be prepared at 1150 degrees C on TiN/SiC substrates and will require an ex situ surface passivation.

Automated summary

This study investigates the molecular beam epitaxy of AlN nanowires and identifies 1150 degrees C as the optimal growth temperature. The growth process involves the grain growth of the TiN film and the formation of preferred {111} facets for AlN nucleation. Luminescence experiments on the nanowires reveal a steep increase in deep-level signals above 1050 degrees C, potentially due to oxygen incorporation from the Al2O3 substrate.