期刊
MICROELECTRONICS RELIABILITY
卷 150, 期 -, 页码 -出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.microrel.2023.115086
关键词
Digital twin; Functional mock-up Interface; System reliability modeling; Object-oriented modeling; Condition monitoring
This paper introduces a framework for creating digital twins by combining different modeling techniques to create an integrated model of a complex electronic system for automotive and railway applications. The framework allows monitoring and diagnosing the behavior of the electronic system in the field. The framework also contributes to the development of digital twins by adding black-box modules to the simulation models. The paper highlights the key features and functionalities of this approach for simulating digital twins.
This Paper introduces a mission profile-based and simulation-driven framework for creating digital twins, by combining different modeling techniques into an integrated model of a complex electronic system used in automotive and railway applications. It envisages monitoring, diagnostics and prognostic of the condition, degradation or abnormalities in the electronic system's behaviour in the field. Furthermore, this work contributes towards the development of digital twins by adding black-box modules to the main simulation models, which can be achieved by employing the functional mock-up interface toolbox. The key features and functionalities of this approach for the simulation of digital twins will be also highlighted in this work. This approach is applied on a common example circuit, a full wave bridge rectifier, whose model is implemented and simulated in Modelica(1). Moreover, the functionality of the investigated circuit, as well as the degradation behaviour under variable external thermal as well as electrical loads, is demonstrated with the help of automated parametric studies performed within Python(+). Finally, the framework is verified using the functional test structure of the full wave diode bridge rectifier.
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