Understanding the role of surface mechanical properties in SiC surface machining

Surface modification layers play a crucial role in enhancing machinability during reaction-assisted machining due to the interrelated behavior of the surface and interface resulting from their structure-properties relationship. However, determining the impact of surface mechanical properties on a coherent interface through experiments is challenging. To overcome this limitation, atomistic simulations were performed, which involved constructing coherent interfaces with varying mechanical properties by adjusting the Tersoff-style potential function. The 4H-SiC machining example involved introducing soft, pristine, and modification layers. The findings indicated that the soft layer acted as a buffer, reducing substrate stress, while the modification layer enhanced efficiency at greater penetration depths, and near-interface dynamic behaviors were altered. Additionally, it was indirectly suggested that the effect of a harder modification layer on the interface may be more significant than the difference in mechanical properties between the modification layer and substrate.

Automated summary

Surface modification layers are important in reaction-assisted machining as they affect the behavior of the surface and interface. Experimentally determining the impact of surface mechanical properties on a coherent interface is challenging, hence atomistic simulations were performed to study this behavior. The findings showed that a soft layer acted as a buffer to reduce substrate stress, while a modification layer enhanced efficiency at greater penetration depths and altered near-interface dynamics. It was also suggested that the effect of a harder modification layer on the interface may be more significant than the mechanical properties difference between the modification layer and substrate.