4.7 Article

Temperature-dependent stacking fault energy, deformation behavior, and tensile properties of a new high-entropy alloy

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ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2023.145522

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Stacking fault energy; High-entropy alloy; Twinning; Deformation behaviour; Friction stress

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This study investigated the deformation behavior and tensile properties of a new high-entropy alloy at room temperature and -100 degrees C. The results showed that the slip configuration transitioned from wavy to planar with decreasing temperature, and deformation twinning only occurred at -100 degrees C. The stacking fault energy of the alloy at -100 degrees C was determined using transmission electron microscopy, while it could not be estimated at room temperature. Activation of planar slip-induced dislocation features at -100 degrees C improved the work hardening and tensile properties of the alloy.
The stacking fault energy (SFE), deformation behavior, and tensile properties of a new high-entropy alloy (HEA), Fe35Mn35Co10Cr10Ni10 (in at. %), were investigated at room temperature (RT) and-100 degrees C. Deformation sub-structure evolution during tensile loading was studied using electron backscattered diffraction (EBSD) and transmission electron microscopy (TEM). A transition in the slip configuration occurred from fully wavy to completely planar with the decrease in temperature from room temperature (RT) to-100 degrees C. The studied alloy revealed the onset of deformation twinning only during deformation at-100 degrees C and the same was absent during RT deformation. SFE of the studied alloy at-100 degrees C was-34.2 (+/- 4) mJ/m(2). SFE determination required the value of the distance between Shockley partial dislocations and the same was determined employing the transmission electron microscopy (TEM) based weak-beam dark field (WBDF) technique. SFE of the studied alloy could not be estimated at RT due to the presence of closely spaced partial dislocations (perhaps due to very high SFE) and therefore partial separation by the presently employed WBDF technique couldn't be achieved. The role of friction stress was limited and SFE was revealed as the main factor in defining the active slip mode in HEAs containing no apparent short-range ordering and similar shear moduli. Activation of planar slip-induced dislo-cation features such as Taylor lattices, microbands, and twinning at-100 degrees C provided greater work hardening resulting in improved tensile properties compared to RT.

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