期刊
MATERIALS & DESIGN
卷 232, 期 -, 页码 -出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2023.112121
关键词
Titanium alloy; Boron addition; Thermomechanical processing; Deformation mechanisms; Mechanical properties
To achieve low-cost titanium alloys with improved strength and ductility, 0.1 wt% of boron was added to the Ti-4Al-2.5V-1.5Fe alloy using titanium diboride (TiB2) as a boron source. The addition of borides greatly influenced the material parameters and improved the spheroidization and recrystallization of the alloy. This resulted in a fine grain structure and improved processibility, mitigating flow localization and enhancing the mechanical properties.
To obtain the low-cost titanium alloys with simultaneously improved strength and ductility by thermomechanical processing, 0.1 wt% of boron was added to the Ti-4Al-2.5V-1.5Fe alloy using titanium diboride (TiB2) as a boron source. The deformation mechanisms and microstructure evolution were systematically studied by comparative investigation of Ti-4Al-2.5V-1.5Fe alloys with and without boron. The results indicated that the addition of boride had a significant effect on the material parameters. Furthermore, TiB greatly improved the spheroidization and recrystallization of the alloy, and it can effectively limit grain growth during thermal exposure. Consequently, both high-temperature forging and further thermal deformation facilitated the generation and retention of the fine grain structure, dramatically improving the processibility of Ti alloys. For bare alloys, severe plastic deformation often leads to inhomogeneous microstructures and flow instability, which is harmful to mechanical integrity. In contrast, the addition of borides can significantly mitigate flow localization. In this study, boron-modified titanium alloys exhibited improved processibility and beneficial mechanical properties attributed to beneficial effects due to the addition of borides, which may enable new strategies for manufacturing highstrength titanium alloys in a more cost-effective way. & COPY; 2023 The Author(s). Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
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