4.7 Article

Fast Visible-Light 3D Printing of Conductive PEDOT:PSS Hydrogels

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WILEY-V C H VERLAG GMBH
DOI: 10.1002/marc.202300229

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3D printing; conducting polymers; hydrogels; PEDOT; PSS; Type II photoinitiator system; visible-light photopolymerization

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Functional inks for light-based 3D printing are being explored, and a fast visible-light photopolymerization process of conductive PEDOT:PSS hydrogels is demonstrated. A new Type II photoinitiator system based on riboflavin, triethanolamine, and PEDOT:PSS is investigated, enabling full monomer conversion in less than 2 min using visible light. PEDOT:PSS plays a dual role by speeding up photoinitiation and enhancing the conductivity of the hydrogels.
Functional inks for light-based 3D printing are actively being searched for being able to exploit all the potentialities of additive manufacturing. Herein, a fast visible-light photopolymerization process is showed of conductive PEDOT:PSS hydrogels. For this purpose, a new Type II photoinitiator system (PIS) based on riboflavin (Rf), triethanolamine (TEA), and poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS) is investigated for the visible light photopolymerization of acrylic monomers. PEDOT:PSS has a dual role by accelerating the photoinitiation process and providing conductivity to the obtained hydrogels. Using this PIS, full monomer conversion is achieved in less than 2 min using visible light. First, the PIS mechanism is studied, proposing that electron transfer between the triplet excited state of the dye ((3)Rf*) and the amine (TEA) is catalyzed by PEDOT:PSS. Second, a series of poly(2-hydroxyethyl acrylate)/PEDOT:PSS hydrogels with different compositions are obtained by photopolymerization. The presence of PEDOT:PSS negatively influences the swelling properties of hydrogels, but significantly increases its mechanical modulus and electrical properties. The new PIS has also been tested for 3D printing in a commercially available Digital Light Processing (DLP) 3D printer (405 nm wavelength), obtaining high resolution and 500 & mu;m hole size conductive scaffolds.

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